參數(shù)資料
型號： GE28F640W30TD70
廠商： INTEL CORP
元件分類： PROM
英文描述： 4M X 16 FLASH 1.8V PROM, 70 ns, PBGA56
封裝： 0.75 MM PITCH, VFBGA-56
文件頁數(shù)： 83/104頁
文件大?。?/td> 1443K
代理商： GE28F640W30TD70
28F640W30, 28F320W30, 28F128W30
June 2005
Intel Wireless Flash Memory (W30)
Datasheet
8
Order Number: 290702, Revision: 011
1.0
Introduction
1.1
Document Purpose
This datasheet contains information about the Intel
Wireless Flash Memory (W30) device family.
Throughout this document, this device family is referred to as the W30 flash memory device.
This chapter provides a flash memory overview.
Chapter 2.0 through Chapter 8.0 describe the memory functionality.
Chapter 6.0 describes the electrical specifications for extended temperature product offerings.
Appendix A describes the Write State Machine (WSM),
Appendix B describes the Intel Common Flash Interface (CFI) as it applies to the W30 flash
memory device.
Appendix C provides ordering information for the Intel Wireless Flash Memory (W30)
device family.
1.2
Nomenclature
Acronyms that describe product features or usage are defined here:
APS - Automatic Power Savings
BBA - Block Base Address
CFI - Common Flash Interface
CUI - Command User Interface
DU - Do not Use
EFP - Enhanced Factory Programming
FDI - Flash Data Integrator
NC - No Connect
OTP - One-Time Programmable
PBA - Partition Base Address
RCR - Read Configuration Register
RWE - Read-While-Erase
RWW - Read-While-Write
SCSP - Stacked Chip Scale Package
SRD - Status Register Data
VF BGA - Very-thin, Fine-pitch, Ball Grid Array
WSM - Write State Machine
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