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參數(shù)資料
| 型號(hào)： | GE28F640W30TD70 |
| 廠商： | INTEL CORP |
| 元件分類： | PROM |
| 英文描述： | 4M X 16 FLASH 1.8V PROM, 70 ns, PBGA56 |
| 封裝： | 0.75 MM PITCH, VFBGA-56 |
| 文件頁數(shù)： | 28/104頁 |
| 文件大?。?/td> | 1443K |
| 代理商： | GE28F640W30TD70 |
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28F640W30, 28F320W30, 28F128W30
Datasheet
Intel Wireless Flash Memory (W30)
June 2005
Order Number: 290702, Revision: 011
3
Contents
Introduction ...............................................................................................................................8
Conventions .......................................................................................................................... 9
Functional Overview ............................................................................................................10
Memory Map and Partitioning ............................................................................................. 11
Package Information ............................................................................................................14
Ballout and Signal Descriptions......................................................................................19
Signal Ballout ......................................................................................................................19
Signal Descriptions ............................................................................................................. 21
Maximum Ratings and Operating Conditions ...........................................................25
Operating Conditions .......................................................................................................... 26
Electrical Specifications .....................................................................................................27
AC Characteristics ................................................................................................................29
Read Operations - 130 nm Lithography..............................................................................29
Read Operations - 180 nm Lithography..............................................................................30
AC Write Characteristics.....................................................................................................40
Power and Reset Specifications .....................................................................................45
Active Power ....................................................................................................................... 45
Automatic Power Savings (APS) ........................................................................................ 45
Standby Power ................................................................................................................... 45
Power-Up/Down Characteristics ......................................................................................... 46
System Reset and RST# ....................................................................................... 46
VCC, VPP, and RST# Transitions .........................................................................46
Power Supply Decoupling................................................................................................... 46
Reset Specifications ........................................................................................................... 47
Flash Device Operations ....................................................................................................50
Bus Operations ................................................................................................................... 50
Read ......................................................................................................................50
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