參數(shù)資料
型號: GE28F640W30TD70
廠商: INTEL CORP
元件分類: PROM
英文描述: 4M X 16 FLASH 1.8V PROM, 70 ns, PBGA56
封裝: 0.75 MM PITCH, VFBGA-56
文件頁數(shù): 15/104頁
文件大?。?/td> 1443K
代理商: GE28F640W30TD70
28F640W30, 28F320W30, 28F128W30
June 2005
Intel Wireless Flash Memory (W30)
Datasheet
18
Order Number: 290702, Revision: 011
Table 4.
32Mb and 128Mb VF BGA Package Dimensions
Dimension
Symbol
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
Package Height
A
0.850
-
1.000
0.0335
-
0.0394
Ball Height
A1
0.150
-
0.0059
-
Package Body Thickness
A2
0.615
0.665
0.715
0.0242
0.0262
0.0281
Ball (Lead) Width
b
0.325
0.375
0.425
0.0128
0.0148
0.0167
Package Body Width 32Mb
D
7.600
7.700
7.800
0.2992
0.3031
0.3071
Package Body Length32Mb
E
8.900
9.000
9.100
0.3503
0.3543
0.3583
Package Body Width 128Mb
D
12.400
12.500
12.600
0.4882
0.4921
0.4961
Package Body Length 128Mb
E
11.900
12.000
12.100
0.4685
0.4724
0.4764
Pitch
[e]
-
0.750
-
0.0295
-
Ball (Lead) Count 32Mb
N
-
56
-
56
-
Ball (Lead) Count 128Mb
N
-
60
-
60
-
Seating Plane Coplanarity
Y
-
0.100
-
0.0039
Corner to Ball A1 Distance Along D 32Mb
S1
1.125
1.225
1.325
0.0443
0.0482
0.0522
Corner to Ball A1 Distance Along E 32Mb
S2
2.150
2.250
2.350
0.0846
0.0886
0.0925
Corner to Ball A1 Distance Along D 128Mb
S1
2.775
2.875
2.975
0.1093
0.1132
0.1171
Corner to Ball A1 Distance Along E 128Mb
S2
2.900
3.000
3.1000
0.1142
0.1181
0.1220
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