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User’s Manual U16890EJ1V0UD
837
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
The V850ES/KG1 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 33-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD703212GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703212YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703213GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703213YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703214GC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD703214YGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD70F3214GC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
μ
PD70F3214YGC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 7 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less, Exposure limit: 7 days
72 hours)
Note
(after that, prebake at 125°C for 10 to
VP15-107-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark
Soldering conditions for the special grade (A), (A1), and (A2) products are the same as for the standard
grade products.