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HMS30C7202N
2004 MagnaChip Semiconductor Ltd. All Rights Reserved. Version 1.1
- 7 -
12.1
A
BSOLUTE
M
AXIMUM
R
ATINGS
.........................................................................................................................161
12.2
DC
CHARACTERISTICS
.......................................................................................................................................162
12.3
A/D
C
ONVERTER
E
LECTRICAL
C
HARACTERISTICS
..............................................................................................163
12.4
D/A
C
ONVERTER
E
LECTRICAL
C
HARACTERISTICS
..............................................................................................164
12.5
AC
C
HARACTERISTICS
.......................................................................................................................................165
12.5.1
Static Memory Interface ...........................................................................................................................165
12.5.1.1 READ Access Timing (Single Mode).....................................................................................................165
12.5.1.2 READ Access Timing (Burst Mode) ......................................................................................................166
12.5.1.3 WRITE Access Timing...........................................................................................................................167
12.5.2
SDRAM Interface......................................................................................................................................168
12.5.3
LCD Interface...........................................................................................................................................169
12.5.4
UART(Universal Asynchronous Receiver Transmitter) ............................................................................171
12.6
P
ACKAGE
...........................................................................................................................................................172
12.6.1
Recommended Soldering Conditions........................................................................................................172
12.6.1.1
MQFP(Metric Quad Flat Pack ) Type...............................................................................................172
12.6.1.2
FBGA(Chip Array Ball Grid Array) Type.........................................................................................172
12.6.2
Pictures of Package Marking ...................................................................................................................173
13
APPENDIX.........................................................................................................................................................174
13.1
D
EEP
-
SLEEP
,
W
AKE
-
UP
I
SSUES OF
HMS30C7202
PMU......................................................................................174
13.1.1
Wake-up....................................................................................................................................................174
13.1.2
Deep-sleep................................................................................................................................................174