19-4750; Rev 1; 07/11 33 of 194 In general, the DCR technique provides better clock recovery performance than th" />
參數(shù)資料
型號(hào): DS34S132GN+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 122/194頁(yè)
文件大?。?/td> 0K
描述: IC TDM OVER PACKET 676-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
功能: TDM-over-Packet(TDMoP)
接口: TDMoP
電路數(shù): 1
電源電壓: 1.8V, 3.3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-PBGA(27x27)
包裝: 管件
其它名稱: 90-34S13+2N0
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)當(dāng)前第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
33 of 194
In general, the DCR technique provides better clock recovery performance than the ACR technique (when
compared using an equal quality synclk reference input for both techniques).
For DCR applications the PW standards assume both ends of the PW use the same frequency for a DCR common
clock reference. The S132 however also allows the DCR common clock frequency to differ from one end to the
other (e.g. 2.5 MHz at one end and 25 MHz at the other), but with the requirement that the two are frequency
locked to the same source (e.g. BITS) and the S132 is programmed to compensate for the frequencies that are
used (Pn.PRCR4 and Pn.PRCR5).
To function well the DCR common clock (CMNCLK) frequency must be an integer multiple of 8 KHz and in the
range of 1 MHz to 25 MHz, but not close to the T1/E1 clock frequency (1.544 MHz or 2.048 MHz). The CMNCLK
frequency can be in the range from 8 KHz to 1 MHz, but with degraded MTIE (Maximum Time Interval Error)
performance. The following frequencies are recommended according to equipment type. The RTP Timestamp
coefficient registers (Pn.PRCR4 and Pn.PRCR5) must be set according to the CMNCLK frequency that is used.
SONET/SDH based equipment – 19.44 MHz
ATM network equipment – 9.72 MHz or 19.44 MHz
GPS based equipment – 8.184 MHz
Ethernet Equipment – 25 MHz
An internal CLAD generates the internal synclk signal from REFCLK or CMNCLK (selected with G.CCR.SCS). Any
of the input frequencies listed below can be used. The input frequency is selected using G.CCR.FS.
5.000 MHz
5.120 MHz
10.00 MHz
10.24 MHz
12.80 MHz
13.00 MHz
19.44 MHz
20.00 MHz
25.00 MHz
30.72 MHz
38.80 MHz
77.76 MHz
155.52 MHz
The S132 includes 32 Clock Recovery Engines that are each hardwired to one of the 32 TDM Ports. One of the 32
TDM Port recovered clocks (aclk_n; n = 0 to 31) can be assigned as a Global Clock Recovery reference (grclk)
using G.GCR.GRCSS. This allows the Clock Recovery Engine for one TDM Port to act as the “master timing” for
other “slave timed” TDM Ports.
An LIUCLK output is generated by the CLAD to provide an optional T1/E1 clock reference for external circuits. The
output is enabled with G.CCR.LCE and the frequency is set using G.CCR.LCS (1.544 MHz or 2.048 MHz).
In the TXP direction, the rate at which TXP Packets are transmitted is always directly related to the rate at which
data is received at the TDM Port. In the RXP direction, there are several methods that can be used to reconstruct
the transmit T1/E1 timing. The multiple timing sources provide the ability to support several different timing
applications and to provide primary and secondary (backup) timing.
In the RXP direction, the TCLKOn signal can derive its timing from RCLKn (the TDM Port receive clock input),
EXTCLK0, EXTCLK1, the internal aclk_n signal (the recovered clock from the Port “n” Clock Recovery Engine) or
the internal grclk signal (Global Recovered Clock that is selected by G.GCR.GRCSS). Only aclk_n and grclk derive
their timing from received RXP Packets. The selected timing source for a TDM Port must be equal to the payload
bit rate of each of the RXP Bundles assigned to that TDM Port. If the timing of the selected clock source differs
from one of its Bundles, then the internal RXP Jitter Buffer for that Bundle will overflow or underrun.
A TDM Port can be timed to an external T1/E1 reference that is input at EXTCLK0 or EXTCLK1 (e.g. for a Network
Timed T1/E1). If the synclk reference input (at REFCLK or CMNCLK) is from a Network Timing source (e.g. BITS 8
KHz), then the LIUCLK output can be tied to EXTCLK0 or EXTCLK1 to provide Network Timing to the TDM Port.
RCLKn can be used as the TCLKOn timing source in applications where the TDM Port must use “Loop Timing”.
“Loop Timing” can be used when the TXP data stream at any node within the network returns the TXP data back in
the RXP direction (loopback). Or it can be used in applications where the local transmit T1/E1 line rate is required
to use the local receive T1/E1 line rate (e.g. RCLKn provides Network Timing).
9.2.1.1 PW-Timing
The TDMoP PW standards define two PW Timing techniques: “Adaptive Clock Recovery” (ACR) and “Differential
Clock Recovery using Differential Timestamps” (DCR-DT). A third technique, using “Absolute Timestamps” (AT), is
supported by some companies, but is not prescribed by the TDMoP standards. The S132 is compatible with each
of these PW-Timing techniques.
The ACR technique uses the (intrinsic) packet transmission rate to convey the PW-Timing (e.g. 1 packet received
every 1 ms). The DCR technique uses RTP Timestamps to convey the PW-Timing information from the originating
side. Differential RTP Timestamps (DCR-DT) provide a means to monitor the time period between successive
packets using time units that are equalized at both ends of the PW through the use of a common clock reference
signal (e.g. Timestamp = 125 might equate to 125 us). The “Absolute RTP Timestamp” (AT) indicates the amount
of data that has been received at the TDM Port (e.g. 1000 bits) making the Absolute Timestamp an integer multiple
相關(guān)PDF資料
PDF描述
DS34T102GN+ IC TDM OVER PACKET 484TEBGA
DS3501U+H IC POT NV 128POS HV 10-USOP
DS3502U+ IC POT DGTL NV 128TAP 10-MSOP
DS3503U+ IC POT DGTL NV 128TAP 10-MSOP
DS3897MX IC TXRX BTL TRAPEZIODAL 20-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS34S132GN+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34S132GNA2+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34T101 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_08 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_09 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip