參數(shù)資料
型號: OR3TP12
英文描述: Field-Programmable System Chip (FPSC) Embedded Master/Target PCI Interface
中文描述: 現(xiàn)場可編程系統(tǒng)芯片(促進(jìn)文化基金)嵌入式主/目標(biāo)PCI接口
文件頁數(shù): 126/128頁
文件大?。?/td> 2450K
代理商: OR3TP12
126
LLucent Technologies Inc.
ORCAOR3TP12 FPSC
Embedded Master/Target PCI Interface
Data Sheet
March 2000
Ordering Information
5-6435(F).d
FPGA SPEED GRADE
DEVICE TYPE
EMBEDDED CORE TYPE
FPGA BASE ARRAY
PACKAGE TYPE
OR3T P1 2
-6
PS
NUMBER OF PINS
TEMPERATURE RANGE
240
Table 47
.
Voltage Options
Table 48
.
Temperature Options
Table 49. Package Options
Table 50. ORCA Series 3+ Package Matrix
Key: C = commercial, I = industrial.
Note: 64-bit PCI available only in 352-pin PBGA package.
Table 51. Embedded Core Type
Table 52
.
FPSC Base Array
Device
OR3T
Voltage
3.3 V
Symbol
(Blank)
I
Description
Commercial
Industrial
Temperature
0
°
C to 70
°
C
–40
°
C to +85
°
C
Symbol
BA
PS
Description
Plastic Ball Grid Array (PBGA)
Power Quad Shrink Flat Package
Device
Package
240-Pin
EIAJ/
SQFP2
PS240
CI
256-Pin
PBGA
352-Pin
PBGA
BA256
CI
BA352
CI
OR3TP12
Symbol
P1
Description
32-/64-bit, 33/66 MHz PCI Bus Interface
Symbol
2
Description
OR3T55 Based 14
×
18 Array
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