參數(shù)資料
型號： BX80524R300128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, MICROPROCESSOR, XMA
封裝： SINGLE EDGE PROCESSOR PACKAGE
文件頁數(shù)： 96/130頁
文件大小： 2654K
代理商： BX80524R300128
68
Datasheet
Intel Celeron Processor up to 1.10 GHz
4.1.1
Thermal Diode
The Celeron processor incorporates an on-die diode that can be used to monitor the die
temperature. A thermal sensor located on the motherboard or a standalone measurement kit may
monitor the die temperature of the Intel Celeron processor for thermal management purposes.
Table 42 to Table 44 provide the diode parameter and interface specifications.
Note:
The reading of the thermal sensor connected to the thermal diode will not necessarily reflect the
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-
die temperature gradients between the location of the thermal diode and the hottest location on the
die at a given point in time, and time based variations in the die temperature measurement. Time
based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is
slower than the rate at which the Tjunction temperature can change.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. At room temperature with a forward bias of 630 mV.
3. n_ideality is the diode ideality factor parameter, as represented by the diode equation:
I-Io(e (Vd*q)/(nkT) – 1).
4. Not 100% tested. Specified by design characterization.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 100
° C with a forward bias current of 5–300 A.
3. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
Ifw=Is(e^ ((Vd*q)/(nkT)) – 1), where Is = saturation current, q = electronic charge, Vd = voltage across the
diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).
4. Not 100% tested. Specified by design characterization.
Table 42. Thermal Diode Parameters (S.E.P. and PPGA Packages)
Symbol
Min
Typ
Max
Unit
Notes
Iforward bias
5
500
uA
1
n_ideality
1.0000
1.0065
1.0173
2,3
Table 43. Thermal Diode Parameters (FC-PGA/FC-PGA2 Packages)
Symbol
Min
Typ
Max
Unit
Notes
Iforward bias
5
300
uA
1
n_ideality
1.0057
1.0080
1.0125
2, 3
Table 44. Thermal Diode Interface
Pin Name
SC242 Connector
Signal #
370-Pin Socket Pin #
Pin Description
THERMDP
B14
AL31
diode anode (p junction)
THERMDN
B15
AL29
diode cathode (n junction)
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