參數(shù)資料
型號: BX80524R300128
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, MICROPROCESSOR, XMA
封裝: SINGLE EDGE PROCESSOR PACKAGE
文件頁數(shù): 82/130頁
文件大?。?/td> 2654K
代理商: BX80524R300128
Datasheet
55
Intel Celeron Processor up to 1.10 GHz
3.2
AGTL+ Signal Quality Specifications and Measurement
Guidelines
Many scenarios have been simulated to generate a set of AGTL+ layout guidelines which are
available in AP-585, Pentium II Processor AGTL+ Guidelines (Order Number 243330). Refer to
the Pentium II Processor Developer's Manual (Order Number 243502) for the AGTL+ buffer
specification.
Table 31 provides the AGTL+ signal quality specifications (for both the S.E.P. and PPGA
Packages) for use in simulating signal quality at the processor core. Table 32 provides the AGTL+
signal quality specifications (for the FC-PGA/FC-PGA2 packages) for use in simulating signal
quality at the processor core. Table 33 provides AGTL+ signal quality guidelines for measuring and
testing signal quality at the processor edge fingers. Figure 13 describes the signal quality waveform
for AGTL+ signals at the processor core and edge fingers. For more information on the AGTL+
interface, see the Pentium II Processor Developer's Manual (Order Number 243502).
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Celeron processor frequencies.
2. Specifications are for the edge rate of 0.3 – 0.8 V/ns. See Figure 13 for the generic waveform.
3. All values specified by design characterization.
4. This specification applies to Intel Celeron processors operating with a 66 MHz Intel Celeron processor
system bus only.
5. Ringback below VREF + 20 mV is not supported.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Celeron processor frequencies.
2. Specifications are for the edge rate of 0.3 – 0.8V/ns. See Figure 13 for the generic waveform.
3. All values specified by design characterization.
4. See Table 36 for maximum allowable overshoot.
5. Ringback between VREF + 100 mV and VREF + 200 mV or VREF – 200 mV and VREF – 100 mVs requires the
flight time measurements to be adjusted as described in the Intel AGTL+ Specifications (IntelPentiumII
Developers Manual
). Ringback below VREF + 100 mV or above VREF – 100 mV is not supported.
6. Intel recommends simulations not exceed a ringback value of VREF ±200 mV to allow margin for other
sources of system noise.
7. A negative value for
ρ indicates that the amplitude of ringback is above VREF. (i.e., φ = –100 mV specifies the
signal cannot ringback below VREF + 100 mV).
8.
φ and ρ: are measured relative to VREF. α: is measured relative to VREF + 200 mV.
9. All Ringback entering the Overdrive Region must have flight time correction.
10.Overshoot specifications for Ringback do not correspond to Overshoot specifications in Section 3.4.
Table 31. AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor Core
(For Both the S.E.P. and PPGA Packages)
T# Parameter
Min
Unit
Figure
Notes
α: Overshoot
100
mV
4
τ: Minimum Time at High
1.00
ns
4
ρ: Amplitude of Ringback
–100
mV
4, 5
φ: Final Settling Voltage
100
mV
4
δ: Duration of Squarewave Ringback
N/A
ns
Table 32. AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor Pins
(For FC-PGA/FC-PGA2 Packages)
T# Parameter
Min
Unit
Figure
Notes
α: Overshoot
100
mV
4, 8, 9, 10
τ: Minimum Time at High
0.50
ns
9
ρ: Amplitude of Ringback
–200
mV
5, 6, 7, 8
φ: Final Settling Voltage
200
mV
8
δ: Duration of Squarewave Ringback
N/A
ns
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