- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄201303 > BX80524R300128 (INTEL CORP) 32-BIT, 300 MHz, MICROPROCESSOR, XMA PDF資料下載
參數(shù)資料
| 型號(hào)： | BX80524R300128 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, MICROPROCESSOR, XMA |
| 封裝： | SINGLE EDGE PROCESSOR PACKAGE |
| 文件頁(yè)數(shù)： | 42/130頁(yè) |
| 文件大小： | 2654K |
| 代理商： | BX80524R300128 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)當(dāng)前第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)
Datasheet
19
Intel Celeron Processor up to 1.10 GHz
The PPGA package has more power (88) and ground (80) pins than the S.E.P. Package. Of the
power pins, 77 are used for the processor core (VCCCORE) and 8 are used as a AGTL+ reference
voltage (VREF). The other 3 power pins are VCC1.5, VCC2.5 and VCCCMOS and are used for future
processor compatibility.
FC-PGA/FC-PGA2 packages have 77 VCCCORE, 77 ground pins, eight VREF, one VCC1.5, one
VCC2.5, and one VCCCMOS. VCCCORE inputs supply the processor core, including the on-die L2
cache. The VREF inputs are used as the AGTL+ reference voltage for the processor.
The VCCCMOS pin is provided as a feature for future processor support in a flexible design. In such
a design, the VCCCMOS pin is used to provide the CMOS voltage for use by the platform.
Additionally, 2.5 V must be provided to the VCC2.5 input and 1.5 V must be provided to the Vcc1.5
input. The processor routes the CMOS voltage level through the package that it is compatible with.
For example, processors requiring 1.5 V CMOS voltage levels route 1.5 V to the VCCCMOS output.
Each power signal, regardless of package, must meet the specifications stated in Table 4. In
addition, all VCCCORE pins must be connected to a voltage island while all VSS pins have to
connect to a system ground plane. In addition, the motherboard must implement the VTT pins as a
voltage island or large trace. Similarly, all VSS pins must be connected to a system ground plane.
2.3.1
Phase Lock Loop (PLL) Power
It is highly critical that phase lock loop power delivery to the processor meets Intel’s requirements.
A low pass filter is required for power delivery to pins PLL1 and PLL2. This serves as an isolated,
decoupled power source for the internal PLL.
2.4
Processor Decoupling
Due to the large number of transistors and high internal clock speeds, the processor is capable of
generating large average current swings between low and full power states. This causes voltages on
power planes to sag below their nominal values if bulk decoupling is not adequate. Care must be
taken in the board design to ensure that the voltage provided to the processor remains within the
specifications listed in Table 5. Failure to do so can result in timing violations or a reduced lifetime
of the component.
2.4.1
System Bus AGTL+ Decoupling
The S.E.P. Package and FC-PGA/FC-PGA2 packages contain high frequency decoupling
capacitance on the processor substrate, where the PPGA package does not. Therefore, Celeron
processors in the PGA packages require high frequency decoupling on the system motherboard.
Bulk decoupling must be provided on the motherboard for proper AGTL+ bus operation for all
packages. See AP-585, Pentium II Processor AGTL+ Guidelines (Order Number 243330), AP-
587, Pentium II Processor Power Distribution Guidelines (Order Number 243332), and the
Pentium
II Processor Developer's Manual (Order Number 243502) for more information.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BZV09/A0332/04 | 3A, 250VAC, FEMALE AND MALE, MAINS POWER CONNECTOR |
| BZV09/A0332/14 | 3A, 250VAC, FEMALE AND MALE, MAINS POWER CONNECTOR |
| BZV09/A0332/37 | 3A, 250VAC, FEMALE AND MALE, MAINS POWER CONNECTOR |
| BKT-146-01-F-V | 92 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
| BKT-146-01-L-V | 92 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80524R30012A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| BX80524R33312A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| BX80525U500256E | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U533256EB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80525U550256E | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。