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參數(shù)資料
| 型號： | BX80524R300128 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, MICROPROCESSOR, XMA |
| 封裝： | SINGLE EDGE PROCESSOR PACKAGE |
| 文件頁數(shù)： | 19/130頁 |
| 文件大?。?/td> | 2654K |
| 代理商： | BX80524R300128 |
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Datasheet
115
Intel Celeron Processor up to 1.10 GHz
6.1.3.1
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the FC-PGA/FC-PGA2 packages will not
weigh more than 180 grams.
6.2
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processors.
6.2.1
Thermal Requirements for the Boxed Intel Celeron Processor
6.2.1.1
Boxed Processor Cooling Requirements
The boxed processor is directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Section 4.0 of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see Section 4.0) in chassis that provide good
thermal management.
For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
heatsink. It is also recommended that the air temperature entering the fan be kept below 45 °C.
Again, meeting the processor's temperature specification is the responsibility of the system
integrator. The processor temperature specification is found in Section 4.0 of this document.
Figure 38. Top View Airspace Requirements for the Boxed Processor in the S.E.P. Package
0.40 Min Air Space (F)
(both ends)
0.20 Min
Air Space
(G)
Measure ambient temperature
0.3" above center of fan inlet
Fan Heatsink
Processor
Airspace
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