參數(shù)資料
型號： BX80524R300128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, MICROPROCESSOR, XMA
封裝： SINGLE EDGE PROCESSOR PACKAGE
文件頁數(shù)： 94/130頁
文件大?。?/td> 2654K
代理商： BX80524R300128
66
Datasheet
Intel Celeron Processor up to 1.10 GHz
NOTES:
1. These values are specified at nominal VCCCORE for the processor core.
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum TJUNCTION specification.
3. FC-PGA package only.
4. The Thermal Design Power (TDP) Celeron processors in production has been redefined. The updated TDP
values are based on device characterization and do not reflect any silicon design changes to lower processor
power consumption. The TDP values represent the thermal design point required to cool Celeron
processors in the platform environment while executing thermal validation type software.
5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
die area over which the power is generated. Power for these processors is generated from the core area
shown in Figure 17.
6. Tjunctionoffset is the worst-case difference between the thermal reading from the on-die thermal diode and the
hottest location on the processor’s core. Tjunctionoffset values do not include any thermal diode kit
measurement error. Diode kit measurement error must be added to the Tjunctionoffset value from the table.
Intel has characterized the use of the Analog Devices AD1021 diode measurement kit and found its
measurement error to be ±1 oC
.
7. For processors with a CPUID of 0683h, the TDP number is 11.2 W.
8. For processors with a CPUID of 0683h, the TDP number is 11.9 W.
9. For processors with a CPUID of 0683h, the TDP number is 12.6 W.
10.The Tj min for processors with a CPUID of 068x is 0 oC with a 3 oC– 5 oC margin error.
Table 40. Processor Power for the PPGA and FC-PGA Packages
Processor
Core
Frequency
L2
Cache
Size
(KB)
Processor
Thermal
Design
Power2,3
(W) up to
CPUID
0686h
Processor
Thermal
Design
Power2,3
(W) for
CPUID
068Ah
Power
Density 5
(W/cm2)
For
CPUID
0686h
Power
Density 5
(W/cm2)
For
CPUID
068Ah
Min
TCASE
(°C)
Max
TCASE
(°C)
Max10
TJUNCTION
(°C)
TJUNCTION
Offset 6
(°C)
333 MHz
128
19.7
NA
5
85
NA
366 MHz
128
21.7
NA
5
85
NA
400 MHz
128
23.7
NA
5
85
NA
433 MHz
128
24.1
NA
5
85
NA
466 MHz
128
25.6
NA
5
70
NA
500 MHz
128
27.0
NA
5
70
NA
533 MHz
128
28.3
NA
5
70
NA
533A3 MHz
128
14.04,7
NA
17.54
NA
90
2.6
5663 MHz
128
14.94,8
19.2
18.54
304
NA
90
2.6
6003 MHz
128
15.84,9
19.64
19.74
30.54
NA
90
2.6
633 MHz
128
16.54
20.24
25.84
31.54
NA
82
2.6
667 MHz
128
17.54
21.14
27.34
32.94
NA
82
2.6
700 MHz
128
18.34
21.94
28.64
34.14
NA
80
2.7
733 MHz
128
19.14
22.84
29.84
35.54
NA
80
2.8
766 MHz
128
20.04
23.64
31.34
36.84
NA
80
3.0
800 MHz
128
20.84
24.54
32.64
38.24
NA
80
3.0
850 MHz
128
22.54
25.74
35.24
40.04
NA
80
3.3
900 MHz
128
NA
26.74
NA
41.64
NA
77
3.6
950 MHz
128
NA
28.0
NA
43.64
NA
79
3.8
1 GHz
128
NA
29.0
NA
45.24
NA
75
3.8
1.10 GHz
128
NA
33.0
NA
51.44
NA
77
4.4
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