參數(shù)資料
型號： BX80524R300128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, MICROPROCESSOR, XMA
封裝： SINGLE EDGE PROCESSOR PACKAGE
文件頁數(shù)： 18/130頁
文件大?。?/td> 2654K
代理商： BX80524R300128
114
Datasheet
Intel Celeron Processor up to 1.10 GHz
6.1.2.1
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the PPGA package will not weigh more than
180 grams.
6.1.3
Mechanical Specifications for the FC-PGA/FC-PGA2 Packages
This section documents the mechanical specifications of the fan heatsink for the boxed Intel
Celeron processor in the FC-PGA/FC-PGA2 (Flip-Chip Pin Grid Array) packages. The boxed
processor in the FC-PGA/FC-PGA2 packages ships with a fan heatsink which has an integrated
clip. Figure 36 shows a mechanical representation of the boxed Intel Celeron processor in the
FC-PGA/FC-PGA2 packages.
Figure 39 and Figure 41 show the REQUIRED keepout dimensions for the boxed processor
thermal solution. The cooling fin orientation on the heatsink relative to the PGA-370 socket is
subject to change. Contact your local Intel sales representative for documentation specific to the
boxed fan heatsink orientation relative to the PGA-370 socket.
The boxed processor fan heatsink is also asymmetrical in that the mechanical step feature
(specified in Figure 37) must sit over the socket’s cam. The step allows the heatsink to securely
interface with the processor in order to meet the processors thermal requirements.
Figure 36. Conceptual Drawing of the Boxed Intel Celeron Processor in the 370-Pin Socket
(FC-PGA/FC-PGA2 Packages)
Figure 37. Dimensions of Mechanical Step Feature in Heatsink Base for the FC-PGA/
FC-PGA2 Packages
0.043
0.472
U nits = inches
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