- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382721 > UDA1352HL (NXP SEMICONDUCTORS) 48 kHz IEC 60958 audio DAC PDF資料下載
參數(shù)資料
| 型號： | UDA1352HL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | 48 kHz IEC 60958 audio DAC |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件頁數(shù)： | 60/64頁 |
| 文件大?。?/td> | 262K |
| 代理商： | UDA1352HL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁當(dāng)前第60頁第61頁第62頁第63頁第64頁
2003 Mar 25
60
Philips Semiconductors
Preliminary specification
48 kHz IEC 60958 audio DAC
UDA1352HL
19.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UDA1360 | Low-voltage low-power stereo audio ADC |
| UDA1360TS | Low-voltage low-power stereo audio ADC |
| UDA1361 | 96 kHz sampling 24-bit stereo audio ADC |
| UDA1380 | Stereo audio coder-decoder for MD, CD and MP3 |
| UDA1380TT | Stereo audio coder-decoder for MD, CD and MP3 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UDA1352TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:48 kHz IEC 60958 audio DAC |
| UDA1352TS/N3 | 制造商:NXP Semiconductors 功能描述:IC DAC AUDIO 48KHZ 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, DAC, AUDIO, 48KHZ, 28-SSOP, Resolution (Bits):20bit, Input Channel Type:Seri |
| UDA1352TS/N3,112 | 功能描述:音頻數(shù)/模轉(zhuǎn)換器 IC DAC 2CH Interpolatio Filter 28-Pin RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量: 分辨率:16 bit 接口類型:I2S, UBS 轉(zhuǎn)換速率: 信噪比:98 dB 工作電源電壓:5 V DAC 輸出端數(shù)量:2 工作溫度范圍:- 25 C to + 85 C 電源電流:23 mA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-32 封裝:Reel |
| UDA1352TS/N3,118 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC DAC 2CH Interpolatio Filter 28-Pin RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| UDA1352TS/N3112 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。