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參數(shù)資料
| 型號(hào)： | TMX320C6201 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | Digital Signal Processors(1600MIPS at 200MHz，8個(gè)功能單元并行操作的DSP) |
| 中文描述： | 數(shù)字信號(hào)處理器（1600MIPS在200MHz，8個(gè)功能單元并行操作的數(shù)字信號(hào)處理器） |
| 文件頁(yè)數(shù)： | 40/72頁(yè) |
| 文件大小： | 1552K |
| 代理商： | TMX320C6201 |
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TMX320C6201
DIGITAL SIGNAL PROCESSOR
SPRS051B – JANUARY 1997 – REVISED JUNE 1997
40
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
heat sink selection process – example 2
Specify operating conditions (this system uses a pre-production version of the ’320C6201):
Pa
T
AMAX
V
AMIN
h
MAX
R
Θ
cs
T
CMAX
= 6.9 W
= 55
°
C
= 140 LFM
= 17 mm
= 0.2
°
C/W
= 90
°
C
Average power dissipated by the junction
Ambient air temperature
Air approach velocity (linear feet per minute)
Height limit for the heat sink (system requirement)
Case to sink thermal resistance (using thermal grease)
Case temperature
Estimate the total power that needs to be dissipated by the heat sink, Ps:
Ps
Ps
= Pa – 2 W
= 6.9 – 2 = 4.9 W
Assume 2W dissipation through the board
Compute the maximum heat sink-to-air thermal resistance R
Θ
sa that maintains the case temperature
below T
CMAX
for the operating conditions specified previously:
R
Θ
sa
R
Θ
sa
R
Θ
sa
R
Θ
sa
+ R
Θ
cs = (T
C
– T
A
) / Ps
= {T
C
– T
A
) / Ps} – R
Θ
cs
= {(90 – 55) / 4.9} – 0.2
= 6.9
°
C/W
Choose the heat sink based on the computed maximum sink-to-air resistance R
Θ
sa and the minimum air
approach velocity inside the enclosure. The heat-sink performance plot in Figure 21 verifies that at 85 LFM
air velocity, the sink-to-air thermal resistance indeed stays at, or below, the Rsa value of 6.9 C/W that is
required to maintain the case temperature below T
CMAX
for the listed operating conditions. Actual
measurement of the case temperature must be performed next to verify heat sink performance.
P
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