參數(shù)資料
型號(hào)： ORT82G5
英文描述： ORCA ORT82G5 1.0.1-25/2.0-2.5/3.125 Gbits/s Backplane Interface FPSC
中文描述： ORCA的ORT82G5 1.0.1-25/2.0-2.5/3.125 Gb /秒背板接口促進(jìn)文化基金
文件頁數(shù)： 87/92頁
文件大小： 1823K
代理商： ORT82G5
Agere Systems Inc.
87
Preliminary Data Sheet
July 2001
1.0-1.25/2.0-2.5/3.125 Gbits/s Backplane Interface
ORCA
ORT82G5 FPSC Eight-Channel
Package Thermal Characteristics
Summary
There are three thermal parameters that are in com-
mon use:
Θ
JA
,
ψ
JC, and
Θ
JC. It should be noted that
all the parameters are affected, to varying degrees, by
package design (including paddle size) and choice of
materials, the amount of copper in the test board or
system board, and system airflow.
Θ
JA
This is the thermal resistance from junction to ambient
(theta-JA, R-theta, etc.):
where T
J
is the junction temperature, T
A,
is the ambient
air temperature, and Q is the chip power.
Experimentally,
Θ
JA is determined when a special ther-
mal test die is assembled into the package of interest,
and the part is mounted on the thermal test board. The
diodes on the test chip are separately calibrated in an
oven. The package/board is placed either in a JEDEC
natural convection box or in the wind tunnel, the latter
for forced convection measurements. A controlled
amount of power (Q) is dissipated in the test chip
’
s
heater resistor, the chip
’
s temperature (T
J
) is deter-
mined by the forward drop on the diodes, and the ambi-
ent temperature (T
A
) is noted. Note that
Θ
JA is
expressed in units of
°
C/W.
ψ
JC
This JEDEC designated parameter correlates the junc-
tion temperature to the case temperature. It is generally
used to infer the junction temperature while the device
is operating in the system. It is not considered a true
thermal resistance and it is defined by:
where T
C
is the case temperature at top dead center,
T
J
is the junction temperature, and Q is the chip power.
During the
Θ
JA measurements described above,
besides the other parameters measured, an additional
temperature reading, T
C
, is made with a thermocouple
attached at top-dead-center of the case.
ψ
JC is also
expressed in units of
°
C/W.
Θ
JC
This is the thermal resistance from junction to case. It
is most often used when attaching a heat sink to the
top of the package. It is defined by:
The parameters in this equation have been defined
above. However, the measurements are performed with
the case of the part pressed against a water-cooled
heat sink to draw most of the heat generated by the
chip out the top of the package. It is this difference in
the measurement process that differentiates
Θ
JC from
ψ
JC.
Θ
JC is a true thermal resistance and is expressed
in units of
°
C/W.
Θ
JB
This is the thermal resistance from junction to board
(
Θ
JL). It is defined by:
where T
B
is the temperature of the board adjacent to a
lead measured with a thermocouple. The other param-
eters on the right-hand side have been defined above.
This is considered a true thermal resistance, and the
measurement is made with a water-cooled heat sink
pressed against the board to draw most of the heat out
of the leads. Note that
Θ
JB is expressed in units of
°
C/W and that this parameter and the way it is mea-
sured are still in JEDEC committee.
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been
determined (see the Estimating Power Dissipation sec-
tion), the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed der-
ating of the device from the 85
°
C junction temperature
used in all of the delay tables is needed. Using the
maximum ambient temperature, T
Amax
, and the power
dissipated by the device, Q (expressed in
°
C), the max-
imum junction temperature is approximated by:
T
Jmax =
T
Amax
+ (Q
Θ
JA)
Table 28
lists the thermal characteristics for all pack-
ages used with the
ORCA
ORT82G5 Series of FPSCs.
Θ
JA
J
T
T
A
–
Q
=
ψ
JC
J
T
T
C
–
Q
=
Θ
JC
J
T
T
C
–
Q
=
Θ
JB
J
T
T
B
–
Q
=
相關(guān)PDF資料
PDF描述
ORT8850 Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver
ORT8850H Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver
ORT8850L Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver
OS1001 Interface IC
OS1010 Optoelectronic
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORT82G5-1BM680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-1BM680I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-1F680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 ORCA FPSC 3.7GBITS/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-1F680I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 ORCA FPSC 2.7Gbits/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-1FN680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*