參數(shù)資料
型號: BX80532KC2800D
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 2800 MHz, MICROPROCESSOR
文件頁數(shù): 32/129頁
文件大小: 1640K
代理商: BX80532KC2800D
Intel Xeon Processor with 512 KB L2 Cache
Datasheet
127
8.4
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor will be directly cooled with a passive heatsink. For the passive heatsink to
effectively cool the boxed processor, it is critical that sufficient, unimpeded, cool air flow over the
heatsink of every processor in the system. Meeting the processor's temperature specification is a
function of the thermal design of the entire system, and ultimately the responsibility of the system
integrator. The processor temperature specification is found in Chapter 6.0. It is important that
system integrators perform thermal tests to verify that the boxed processor is kept below its
maximum temperature specification in a specific baseboard and chassis.
At an absolute minimum, the boxed processor heatsink will require 500 Linear Feet per Minute
(LFM) of cool air flowing over the heatsink. The airflow must be directed from the outside of the
chassis directly over the processor heatsinks in a direction passing from one retention mechanism
to the other. It also should flow from the front to the back of the chassis. Directing air over the
passive heatsink of the boxed Product Name processor can be done with auxiliary chassis fans, fan
ducts, or other techniques.
It is also recommended that the ambient air temperature outside of the chassis be kept at or below
35 °C. The air passing directly over the processor heatsink should not be preheated by other system
components (such as another processor), and should be kept at or below 45 °C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator. The processor
temperature specification is found in Chapter 6.0.
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