參數(shù)資料
型號: BX80532KC2800D
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 2800 MHz, MICROPROCESSOR
文件頁數(shù): 125/129頁
文件大?。?/td> 1640K
代理商: BX80532KC2800D
Intel Xeon Processor with 512 KB L2 Cache
Datasheet
95
6.0
Thermal Specifications
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel
Xeon processor with 512 KB L2 cache. Thermal solutions should include heatsinks that
attach to the integrated heat spreader (IHS). The IHS provides a common interface intended to be
compatible with many heatsink designs. Thermal specifications are based on the temperature of the
IHS top, referred to as the case temperature, or TCASE. Thermal solutions should be designed to
maintain the processor within TCASE specifications. For information on performing TCASE
measurements, refer to the Intel Xeon Processor Thermal Design Guidelines. See Figure 37 for
an exploded view of the processor package and thermal solution assembly.
Note:
The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in Figure 37 must be purchased separately.
Note:
This is a graphical representation. For specifications, see each component’s respective
documentation listed in Section 1.3.
Figure 37. Processor with Thermal and Mechanical Components - Exploded View
EMI ground
fram e
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket
EMI ground
fram e
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket
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