參數(shù)資料
型號(hào)： TMS320F28335_1
廠商： Texas Instruments, Inc.
英文描述： Variable Capacitance Diode for TV Tuner VHF Tuning; Ratings VR (V): 32; Characteristics n: 12.0 min; Characteristics rs (ohm) max: 0.85; Characteristics C (pF) max: C2 = 32.2 to 37.5 C25 = 2.57 to 3.0; Characteristics CVR/CVR: 2/25; Cl: 2.777; Package: UFP
中文描述： 數(shù)字信號(hào)控制器（DSC）
文件頁數(shù)： 2/166頁
文件大小： 1889K
代理商： TMS320F28335_1
Contents
TMS320F28335, TMS320F28334, TMS320F28332
Digital Signal Controllers (DSCs)
SPRS439B–JUNE 2007–REVISED OCTOBER 2007
Revision History
..........................................................................................................................
10
1
TMS320F28335, TMS320F28334, TMS320F28332 DSCs
............................................................
11
1.1
Features
.....................................................................................................................
11
1.2
Getting Started
..............................................................................................................
12
2
Introduction
.......................................................................................................................
13
2.1
Pin Assignments
............................................................................................................
13
2.2
Signal Descriptions
.........................................................................................................
23
3
Functional Overview
...........................................................................................................
32
3.1
Memory Maps
..............................................................................................................
33
3.2
Brief Descriptions
...........................................................................................................
39
3.2.1
C28x CPU
.......................................................................................................
39
3.2.2
Memory Bus (Harvard Bus Architecture)
....................................................................
40
3.2.3
Peripheral Bus
..................................................................................................
40
3.2.4
Real-Time JTAG and Analysis
................................................................................
40
3.2.5
External Interface (XINTF)
.....................................................................................
40
3.2.6
Flash
..............................................................................................................
40
3.2.7
M0, M1 SARAMs
...............................................................................................
41
3.2.8
L0, L1, L2, L3, L4, L5, L6, L7 SARAMs
.....................................................................
41
3.2.9
Boot ROM
........................................................................................................
41
3.2.10
Security
..........................................................................................................
42
3.2.11
Peripheral Interrupt Expansion (PIE) Block
..................................................................
43
3.2.12
External Interrupts (XINT1-XINT7, XNMI)
....................................................................
43
3.2.13
Oscillator and PLL
..............................................................................................
44
3.2.14
Watchdog
........................................................................................................
44
3.2.15
Peripheral Clocking
.............................................................................................
44
3.2.16
Low-Power Modes
..............................................................................................
44
3.2.17
Peripheral Frames 0, 1, 2, 3 (PFn)
...........................................................................
44
3.2.18
General-Purpose Input/Output (GPIO) Multiplexer
.........................................................
45
3.2.19
32-Bit CPU-Timers (0, 1, 2)
...................................................................................
45
3.2.20
Control Peripherals
.............................................................................................
45
3.2.21
Serial Port Peripherals
.........................................................................................
46
3.3
Register Map
................................................................................................................
46
3.4
Device Emulation Registers
...............................................................................................
48
3.5
Interrupts
....................................................................................................................
49
3.5.1
External Interrupts
..............................................................................................
53
3.6
System Control
.............................................................................................................
53
3.6.1
OSC and PLL Block
............................................................................................
55
3.6.2
Watchdog Block
.................................................................................................
58
3.7
Low-Power Modes Block
..................................................................................................
59
4
Peripherals
........................................................................................................................
60
4.1
DMA Overview
..............................................................................................................
61
4.2
32-Bit CPU-Timers 0/1/2
..................................................................................................
62
4.3
Enhanced PWM Modules (ePWM1/2/3/4/5/6)
..........................................................................
64
4.4
High-Resolution PWM (HRPWM)
........................................................................................
66
4.5
Enhanced CAP Modules (eCAP1/2/3/4/5/6)
............................................................................
67
4.6
Enhanced QEP Modules (eQEP1/2)
.....................................................................................
69
4.7
Analog-to-Digital Converter (ADC) Module
.............................................................................
71
4.7.1
ADC Connections if the ADC Is Not Used
...................................................................
74
4.7.2
ADC Registers
...................................................................................................
74
4.7.3
ADC Calibration
..................................................................................................
75
Contents
2
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參數(shù)描述
TMS320F28335PGFA 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Digital Signal Controller RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320F28335PGFA 制造商:Texas Instruments 功能描述:IC DSC 32BIT 512KB 150MHZ 1.995V LQFP176
TMS320F28335PTPQ 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Delfino Micrcntrlr RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320F28335PTPS 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Delfino Micrcntrlr RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320F28335ZHHA 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Digital Signal Controller RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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