參數(shù)資料
型號(hào)： MT49H32M9C
廠商： Micron Technology, Inc.
英文描述： 288Mb SIO REDUCED LATENCY(RLDRAM II)
中文描述： 288Mb二氧化硅約化延遲（延遲DRAM二）
文件頁數(shù)： 44/44頁
文件大?。?/td> 1117K
代理商： MT49H32M9C
16 MEG x 18, 32 MEG x 9
2.5V V
EXT
, 1.8V V
DD
, HSTL, SIO, RLDRAM II
pdf: 09005aef80a41b59/zip: 09005aef811ba111
MT49H8M18C_2.fm - Rev. F 11/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
44
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
RLDRAM is a trademark of Infineon Technologies AG in various countries, and is used by Micron under license from Infineon.
All other trademarks are the property of their respective owners.
Figure 43: 144-Ball FBGA
NOTE:
1. All dimensions in millimeters.
Data Sheet Designation
No Marking:
This data sheet contains minimum and maximum limits specified over the complete power supply
and temperature range for production devices. Although considered final, these specifications are subject to
change, as further product development and data characterization sometimes occur.
BALL A1 ID
17.90 CTR
0.555 ±0.050
0.125 ±0.025
0.39 ±0.05
BALL A1 ID
0.10 C
C
SEATING PLANE
10o TYP
0.05 MAX
10.70 CTR
11.00 ±0.10
4.40 ±0.05
5.50 ±0.05
8.80
2.40 CTR
0.80 TYP
1.00 TYP
9.25 ±0.05
8.50 ±0.05
17.00
18.50 ±0.10
144X
0.45
DIMENSIONS APPLY TO SOLDER
BALLS POST REFLOW. THE
PRE-REFLOW BALL DIAMETER IS
0.50MM ON A 0.40MM SMD BALL PAD.
BALL A12
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 62% Sn, 36% Pb, 2%Ag
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