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5.2 Recommended Operating Conditions
(1)
TMS320DM6437
Digital Media Processor
SPRS345B–NOVEMBER 2006–REVISED MARCH 2007
MIN
NOM
MAX
UNIT
(-600, -500, -400
devices)
1.14
1.2
1.26
V
CV
DD
Supply voltage, Core (CV
DD
, V
DDA_1P1V
)
(2)
(-400 devices)
1.0
1.05
1.1
V
Supply voltage, I/O, 3.3V (DV
DD33
)
3.14
3.3
3.46
V
DV
DD
Supply voltage, I/O, 1.8V (DV
DDR2
, DDR_VDDDLL, PLL
PWR18
,
V
DDA_1P8V
, MXV
DD(3)
)
1.71
1.8
1.89
V
Supply ground (V
SS
, V
SSA_1P8V
, V
SSA_1P1V
, DDR_VSSDLL,
MXV
SS(4)
)
V
SS
0
0
0
V
DDR_VREF
DDR2 reference voltage
(5)
0.49DV
DDR2
0.5DV
DDR2
0.51DV
DDR2
V
DDR_ZP
DDR2 impedance control, connected via 200
resistor to V
SS
V
SS
V
DDR2 impedance control, connected via 200
resistor to
DV
DDR2
DDR_ZN
DV
DDR2
V
DAC_VREF
DAC reference voltage input
0.475
0.5
0.525
V
DAC_RBIAS
DAC biasing, connected via 4 k
resistor to V
SSA_1P8V
V
SSA_1P8V
V
High-level input voltage, 3.3V (except PCI-capable and I2C pins)
2
V
V
IH
High-level input voltage, PCI
0.5DV
DD33
DV
DD33
+ 0.5
V
High-level input voltage, I2C
0.7DV
DD33
Low-level input voltage, 3.3V (except PCI-capable and I2C pins)
0.8
V
V
IL
Low-level input voltage, PCI
–0.5
0.3DV
DD33
V
Low-level input voltage, I2C
0
0.3DV
DD33
V
Commercial
0
90
°
C
T
J
Operating Junction temperature
(6)(7)
Extended
–40
125
°
C
Commercial
0
70
°
C
T
A
Operating Ambient temperature
(7)
Extended
-40
85
°
C
(-600 devices)
600
MHz
F
SYSCLK1
DSP Operating Frequency (SYSCLK1)
(-500 devices)
500
MHz
(-400 devices)
400
MHz
(1)
For -400 speed devices, either a 1.05-V
or
a 1.2-V core supply voltage can be used. The actual voltage
must
be determined at device
power-up, and
not
be changed dynamically during run-time.
Future variants of TI SoC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,
1.1 V, 1.14 V, 1.2 V, 1.26 V with
±
3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Not incorporating a flexible supply may limit the system's ability to easily adapt to future versions of TI SoC
devices.
Oscillator 1.8 V power supply (MXV
) can be connected to the same 1.8 V power supply as DV
.
Oscillator ground (MXV
) must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
DDR_VREF is expected to equal 0.5DV
of the transmitting device and to track variations in the DV
.
In the absence of a heat sink or direct thermal attachment on the top of the device, use the following formula to determine the device
junction temperature: T
= T
+ (Power x Psi
). Power and T
can be measured by the user.
Section 7.1
,
Thermal Data for ZWT
and
Section 7.1.1
,
Thermal Data for ZDU
provide the junction-to-package top (PSI
) value based on airflow in the system. In the presence
of a heat sink or direct thermal attachment on the top of the device, additional calculations and considerations
must
be taken into
account. For more detailed information on thermal considerations, measurements, and calculations, see the
TMS320DM643x Thermal
Considerations
Application Report (literuature number SPRAA
TBD
).
Applications must meet
both
the Operating Junction Temperature and Operating Ambient Temperature requirements. For more detailed
information on thermal considerations, measurements, and calculations, see the
TMS320DM643x Thermal Considerations
Application
Report (literuature number SPRAA
TBD).
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Device Operating Conditions
163