參數(shù)資料
型號： OR3TP12-6BA352I
英文描述： Quad 2.3V 10 MHz OP, I temp, -40C to +85C, 14-TSSOP, TUBE
中文描述： 用戶可編程ASIC的特殊功能
文件頁數(shù)： 1/128頁
文件大?。?/td> 2450K
代理商： OR3TP12-6BA352I
Data Sheet
March 2000
ORCA
OR3TP12 Field-Programmable System Chip (FPSC)
Embedded Master/Target PCI Interface
Introduction
Lucent Technologies Microelectronics Group has
developed a solution for designers who need the
many advantages of an FPGA-based design imple-
mentation coupled with the high bandwidth of the
industry-standard PCI interface. The ORCA
OR3TP12 FPSC provides a full-featured
33/50/66 MHz, 32-/64-bit PCI interface, fully
designed and tested, in hardware, plus FPGA logic
for user-programmable functions.
PCI Local Bus
PCI local bus, or simply, PCI bus, has become an
industry-standard interface protocol for use in appli-
cations ranging from desktop PC busing to high-
bandwidth backplanes in networking and communi-
cations equipment. The PCI bus specification* pro-
vides for both 5 V and 3.3 V signaling environments.
The PCI interface clock speed is specified in the
range from dc to 66 MHz with detailed specifications
at 33 MHz and 66 MHz as well as recommendations
for 50 MHz operation. Data paths are defined as
either 32-bit or 64-bit. These data path and frequency
combinations allow for the peak data transfer rates
described in Table 1.
Table 1. PCI Local Bus Data Rates
The PCI bus is electrically specified so that no glue
logic is required to interface to the bus—PCI devices
interface directly to the PCI bus. Other features
include registers for device and subsystem identifica-
tion and autoconfiguration, support for 64-bit
addressing, and multimaster capability that allows
any PCI bus Master access to any PCI bus Target.
PCI Bus Core Highlights
I
Implemented in an ORCA Series 3 base array, dis-
placing the bottom four rows of 18 columns.
I
Core is a well-tested ASIC model.
I
Fully compliant to Revision 2.1 of PCI Local Bus
Specification (and designed for Revision 2.2).
* PCI Local Bus Specification Rev. 2.1, PCI SIG, June 1, 1995.
Clock
Frequency
(MHz)
33
33
66
66
Data Path
Width (bits)
Peak Data Rate
(Mbytes)
32
64
32
64
132
264
264
528
Table 2. ORCA PCI FPSC Solutions—Available FPGA Resources
* The embedded core and interface comprise approximately 85K standard-cell ASIC gates in addition to these usable gates. The usable
gate counts range from a logic-only gate count to a gate count assuming 30% of the PFUs/SLICs being used as RAMs. The logic-only
gate count includes each PFU/SLIC (counted as 108 gates per PFU/SLIC), including 12 gates per LUT/FF pair (eight per PFU), and 12
gates per SLIC/FF pair (one per PFU). Each of the four PIOs per PIC is counted as 16 gates (two FFs, fast-capture latch, output logic,
clk
drivers, and I/O buffers). PFUs used as RAM are counted at four gates per bit, with each PFU capable of implementing a 32
×
4 RAM (or
512 gates) per PFU.
Device
Usable Gates
*
Number of
LUTs
2016
Number of
Registers
2636
Max User
RAM
32K
Max User
I/Os
187
Array
Size
14
×
18
Number of
PFUs
252
OR3TP12
30K—60K
相關PDF資料
PDF描述
OR3TP12-6PS240 Single 2.3V 10 MHZ OP, -40C to +125C, 14-SOIC 150mil, T/R
OR3TP12-6PS240I Quad 2.3V 10 MHz OP, I temp, -40C to +85C, 14-SOIC 150mil, T/R
OR3TP12 Field-Programmable System Chip (FPSC) Embedded Master/Target PCI Interface
OR62 OR62 is a 6-input OR gate with 2x drive strength
OR73 7-input OR gate with 3x drive strength.
相關代理商/技術參數(shù)
參數(shù)描述
OR3TP126BAN256-DB 制造商:Lattice Semiconductor Corporation 功能描述:
OR3TP12-6PS240 制造商:未知廠家 制造商全稱:未知廠家 功能描述:User Programmable Special Function ASIC
OR3TP12-6PS240I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:User Programmable Special Function ASIC
OR3TP127BA256-DB 功能描述:FPGA - 現(xiàn)場可編程門陣列 2016 LUT 187 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
OR3TP127BA352-DB 功能描述:FPGA - 現(xiàn)場可編程門陣列 2016 LUT 187 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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