參數(shù)資料
型號: HYB18T1G800C4F-3
廠商: QIMONDA AG
元件分類: DRAM
英文描述: 128M X 8 DDR DRAM, 0.45 ns, PBGA60
封裝: GREEN, PLASTIC, TFBGA-60
文件頁數(shù): 34/58頁
文件大?。?/td> 1898K
代理商: HYB18T1G800C4F-3
HYB18T1G[40/80/16]0C4F
1-Gbit Double-Data-Rate-Two SDRAM
Internet Data Sheet
Rev. 1.01, 2008-11
4
04212008-66HT-ZLFE
TABLE 1
Performance Table
1.2
Description
The 1-Gbit DDR2 DRAM is a high-speed Double-Data-Rate-
Two
CMOS
Synchronous
DRAM
device
containing
1,073,741,824 bits and internally configured as an octal bank
DRAM.
The 1-Gbit device is organized as 32 Mbit
×4 I/O ×8 banks or
16 Mbit
×8 I/O ×8 banks or 8 Mbit ×16 I/O ×8 banks chip.
These synchronous devices achieve high speed transfer
rates starting at 400 Mb/sec/pin for general applications. See
Table 1 for performance figures.
The device is designed to comply with all DDR2 DRAM key
features:
1. Posted CAS with additive latency.
2. Write latency = read latency - 1.
3. Normal and weak strength data-output driver.
4. Off-Chip Driver (OCD) impedance adjustment.
5. On-Die Termination (ODT) function.
All of the control and address inputs are synchronized with a
pair of externally supplied differential clocks. Inputs are
latched at the cross point of differential clocks (CK rising and
CK falling). All I/Os are synchronized with a single ended
DQS or differential DQS-DQS pair in a source synchronous
fashion.
A 17 bit address bus for ×4 and ×8 organised components
and a 16 bit address bus for ×16 components is used to
convey row, column and bank address information in a RAS-
CAS multiplexing style.
The DDR2 device operates with a 1.8 V
± 0.1 V power
supply. An Auto-Refresh and Self-Refresh mode is provided
along with various power-saving power-down modes.
The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode of
operation.
The DDR2 SDRAM is available in TFBGA package.
QAG Speed Code
–25F
–2.5
–3
–3S
Unit
Note
DRAM Speed Grade
DDR2
–800D
–800E
–667C
–667D
CAS-RCD-RP latencies
5–5–5
6–6–6
4–4–4
5–5–5
t
CK
Max. Clock Frequency
CL3
f
CK3
200
MHz
CL4
f
CK4
266
333
266
MHz
CL5
f
CK5
400
333
MHz
CL6
f
CK6
400
MHz
CL7
f
CK7
400
MHz
Min. RAS-CAS-Delay
t
RCD
12.5
15
12
15
ns
Min. Row Precharge Time
t
RP
12.5
15
12
15
ns
Min. Row Active Time
t
RAS
40
ns
Min. Row Cycle Time
t
RC
52.5
55
52
55
ns
Precharge-All (8 banks) command
period
t
PREA
15
17.5
15
18
ns
1)2)
1) This
t
PREA value is the minimum value at which this chip will be functional.
2) Precharge-All command for an 8 bank device will equal to
t
RP + 1 × tCK or tnRP + 1 × nCK, depending on the speed bin,
where
t
nRP = RU{ tRP / tCK(avg) } and tRP is the value for a single bank precharge.
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