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ADV7184
Rev. A | Page 9 of 112
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND
4 V
DVDD to DGND
2.2 V
PVDD to AGND
2.2 V
DVDDIO to DGND
4 V
DVDDIO to AVDD
0.3 V to +0.3 V
PVDD to DVDD
0.3 V to +0.3 V
DVDDIO to PVDD
0.3 V to +2 V
DVDDIO to DVDD
0.3 V to +2 V
AVDD to PVDD
0.3 V to +2 V
AVDD to DVDD
0.3 V to +2 V
Digital Inputs Voltage to DGND
0.3 V to DVDDIO + 0.3 V
Digital Output Voltage to DGND
0.3 V to DVDDIO + 0.3 V
Analog Inputs to AGND
AGND 0.3 V to AVDD + 0.3 V
Maximum Junction Temperature
(TJ max)
125°C
Storage Temperature Range
65°C to +150°C
Infrared Reflow Soldering (20 sec)
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption the user is advised to turn off
any unused ADCs when using the part.
The junction temperature must always stay below the
maximum junction temperature (TJ max) of 125°C. Use the
following equation to calculate the junction temperature:
TJ = TA max + (θJA × Wmax)
where:
TA max = 85°C.
θJA = 30°C/W.
Wmax = ((AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO) +
(PVDD × IPVDD)).
ESD CAUTION