參數(shù)資料
型號(hào): HY27UA081G1M-TIB
廠商: HYNIX SEMICONDUCTOR INC
元件分類: PROM
英文描述: 128M X 8 FLASH 3.3V PROM, 12000 ns, PDSO48
封裝: 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
文件頁數(shù): 24/43頁
文件大?。?/td> 729K
代理商: HY27UA081G1M-TIB
Rev 0.5 / Oct. 2004
30
HY27UA(08/16)1G1M Series
HY27SA(08/16)1G1M Series
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
Note: (1). The time to Ready depends on the value of the pull-up resistor tied to the Ready/Busy pin. See Figures 32, 33 and 34.
(2). To break the sequential read cycle, CE must be held High for longer than tEHEL.
(3). ES = Electronic Signature.
tWHBL
tWB
Write Enable High to Ready/Busy Low
Max
100
ns
tWHRL
tWHR
Write Enable High to Read Enable Low
Min
60
ns
tWLWL
tWC
Write Enable Low to
Write Enable Low
Write Cycle time
Min
60
80
ns
Alt.
Symbol
Parameter
3.3V
Device
1.8V
Device
Unit
Figure 21. Command Latch AC Waveforms
Command
tCLHWL
(CLE Setup time)
tHWCLL
(CLE Hold time)
tELWL
(CE Setup time)
tWHEH
(CE Hold time)
tWLWH
tALLWL
(ALE Setup time)
tWHALH
(ALE Hold time)
tDVWH
(Data Setup time)
tWHDX
(Data Hold time)
CLE
ALE
I/O
CE
WE
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