
Specifications
Thermal Characteristics
2-2
DSP56364 Advance Information
MOTOROLA
2.3
THERMAL CHARACTERISTICS
Table 2-1 Maximum Ratings
Rating
1
Symbol
Value
1, 2
Unit
Supply Voltage
V
CC
0.3 to +4.0
V
All input voltages excluding “5 V tolerant” inputs
3
V
IN
GND -0.3 to V
CC
+ 0.3
V
All “5 V tolerant” input voltages
3
V
IN5
GND
0.3 to V
CC
+ 3.95
V
Current drain per pin excluding V
CC
and GND
I
10
mA
Operating temperature range
T
J
-40 to +105
°
C
Storage temperature
T
STG
55 to +125
°
C
Notes:
1.
2.
GND = 0 V, V
CC
= 3.3 V
±
0.16 V, T
J
= –0
°
C to +105
°
C, CL = 50 pF
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not
guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent
damage to the device.
CAUTION
: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply
voltage; this restriction applies to “power on”, as well as during normal operation. In any case, the
input voltages cannot be more than 5.75 V. “5 V Tolerant” inputs are inputs that tolerate 5 V.
3.
Table 2-2 Thermal Characteristics
Characteristic
Symbol
TQFP Value
Unit
Junction-to-ambient thermal resistance
1
R
θ
JA
or
θ
JA
49.87
°
C/W
Junction-to-case thermal resistance
2
R
θ
JC
or
θ
JC
9.26
°
C/W
Thermal characterization parameter
Ψ
JT
2.0
°
C/W
Notes:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided
printed circuit board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment and
Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111.)
Measurements were done with parts mounted on thermal test boards conforming to specification
EIA/JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88,
with the exception that the cold plate temperature is used for the case temperature.
2.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.