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參數(shù)資料
| 型號： | UDA1384 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Multichannel audio coder-decoder |
| 中文描述： | 多聲道音頻編碼解碼器 |
| 文件頁數(shù)： | 50/55頁 |
| 文件大小： | 276K |
| 代理商： | UDA1384 |
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9397 750 14366
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 17 January 2005
50 of 55
Philips Semiconductors
UDA1384
Multichannel audio coder-decoder
18. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate to
handling integrated circuits.
19. Soldering
19.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
19.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
19.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UDA1384H | 功能描述:編碼器、解碼器、復用器和解復用器 LO CST MULTICH CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H/N1,518 | 功能描述:編碼器、解碼器、復用器和解復用器 LOW COST MULTICHANNEL CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H/N1,557 | 功能描述:編碼器、解碼器、復用器和解復用器 LOW COST MULTICHANNEL CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1384H-T | 功能描述:編碼器、解碼器、復用器和解復用器 LO CST MULTICH CODEC RoHS:否 制造商:Micrel 產品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| UDA1431T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:16-bit, 48 kHz, low-cost stereo current DAC |
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