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參數(shù)資料
| 型號： | RJ80530MY650256 |
| 元件分類： | 微處理器 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|BGA|479PIN|CERAMIC |
| 中文描述： | 微處理器| 32位|的CMOS | BGA封裝| 479PIN |陶瓷 |
| 文件頁數(shù)： | 55/89頁 |
| 文件大?。?/td> | 1672K |
| 代理商： | RJ80530MY650256 |
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Mobile Intel
Pentium
III Processor-M Datasheet
298340-002
Datasheet
55
5.
Mechanical Specifications
5.1
Socketable Micro-FCPGA Package
The Mobile Intel Pentium
III
Processor-M is packaged in a 478-pin Micro-FCPGA package. The Low
Voltage and Ultra Low Voltage processors will not be available in this package. The mechanical
specifications for the socketable package are provided in Table 36. Figure 22 through Figure 24
illustrate different views of the package.
Table 36. Socketable Micro-FCPGA Package Specification
Symbol
Parameter
Min
Max
Unit
A
Overall height, top of die to package seating plane
1.81
2.03
mm
-
Overall height, top of die to PCB surface, including socket(1)
4.69
5.15
mm
A1
Pin length
1.95
2.11
mm
A2
Die height
0.854
mm
A3
Pin-side capacitor height
-
1.25
mm
B
Pin diameter
0.28
0.36
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
11.18
mm
E1
Die width
7.19
mm
e
Pin pitch
1.27
mm
K
Package edge keep-out
5
mm
K1
Package corner keep-out
7
mm
K3
Pin-side capacitor boundary
14
mm
-
Pin tip radial true position
<=0.254
mm
N
Pin count
478
each
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W
Package weight
4.5
g
Package Surface Flatness
0.286
mm
NOTES:
1.
All dimensions are subject to change.
2.
Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
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