參數(shù)資料
型號: HYB18L256160B
廠商: QIMONDA
英文描述: DRAMs for Mobile Applications 256-Mbit Mobile-RAM
中文描述: DRAM的針對移動應用256兆移動RAM
文件頁數(shù): 52/58頁
文件大?。?/td> 1766K
代理商: HYB18L256160B
Data Sheet
Rev. 1.73, 2006-09
01302004-CZ2R-J9SE
52
HY[B/E]18L256160B[C/F]L-7.5
256-Mbit Mobile-RAM
TABLE 28
Self Refresh Currents
Parameter & Test Conditions
Max.
Temperature
Symbol
Values for
HY[B/E]256160B[C/F]
Values for
HYE256160B[C/F]L
Units Note
1)2)
1) 0
°
C
T
C
70
°
C (comm.); -25
°
C
T
C
85
°
C (ext.);
V
DD
=
V
DDQ
= 1.65V to 1.95V
2) The On-Chip Temperature Sensor (OCTS) adjusts the refresh rate in self refresh mode to the component’s actual temperature with a much
finer resolution than supported by the 4 distinct temperature levels as defined by JEDEC for TCSR. At production test the sensor is
calibrated, and IDD6 max. current is measured at 85°C. Typ. values are obtained from device characterization.
typ.
max.
typ.
max.
Self Refresh Current:
Self refresh mode,
full array activation
(PASR = 000)
85
°
C
70
°
45 °C
25 °C
85
°
C
70 °C
45 °C
25 °C
85
°
C
70 °C
45 °C
25 °C
I
DD6
510
340
225
205
400
285
200
180
340
250
185
170
600
470
400
430
285
190
175
305
220
155
140
245
180
135
120
450
320
260
μ
A
Self Refresh Current:
Self refresh mode,
half array activation
(PASR = 001)
Self Refresh Current:
Self refresh mode,
quarter array activation
(PASR = 010)
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