參數(shù)資料
型號： GS8170S72
廠商： GSI TECHNOLOGY
英文描述： 16Mb（256K x 72Bit）Synchronous SRAM(16M位（256K x 72位）同步靜態(tài)RAM)
中文描述： 16Mb的（256 × 72Bit）同步SRAM（1,600位（256 × 72位）同步靜態(tài)內(nèi)存）
文件頁數(shù)： 37/38頁
文件大小： 934K
代理商： GS8170S72
Rev: 1.01 11/2000
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
37/38
2000, Giga Semiconductor, Inc.
A
Advanced Information
GS8170S18/36/72B-333/300/275/250
Ordering Information—GSI Sigma RAM
Org
Part Number
1
Type
Package
Speed
2
(MHz
/ns
)
T
A3
256K x 72
GS8170
S
72B-333
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
333/5
C
256K x 72
GS8170
S
72B-300
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300/5.5
C
256K x 72
GS8170
S
72B-275
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275/6
C
256K x 72
GS8170
S
72B-250
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250/6.7
C
256K x 72
GS8170
S
72B-333I
Common I/O
Σ
RAM
1 mm Pitch, 209 Pin BGA
333/5
I
256K x 72
GS8170
S
72B-300I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300/5.5
I
256K x 72
GS8170
S
72B-275I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275/6
I
256K x 72
GS8170
S
72B-250I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250/6.7
I
512K x 36
GS8170
S
36B-333
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
333
/5
C
512K x 36
GS8170
S
36B-300
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300
/5.5
C
512K x 36
GS8170
S
36B-275
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275
/6
C
512K x 36
GS8170
S
36B-250
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250
/6.7
C
512K x 36
GS8170
S
36B-333I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
333
/5
I
512K x 36
GS8170
S
36B-300I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300
/5.5
I
512K x 36
GS8170
S
36B-275I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275
/6
I
512K x 36
GS8170
S
36B-250I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250
/6.7
I
1Mx 18
GS8170
S
18B-333
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
333
/5
C
1Mx 18
GS8170
S
18B-300
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300
/5.5
C
1Mx 18
GS8170
S
18B-275
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275
/6
C
1Mx 18
GS8170
S
18B-250
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250
/6.7
C
1Mx 18
GS8170
S
18B-333I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
333
/5
I
1Mx 18
GS8170
S
18B-300I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
300
/5.5
I
1Mx 18
GS8170
S
18B-275I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
275
/6
I
1Mx 18
GS8170
S
18B-250I
Common I/O
Σ
RAM
1 mm Pitch, 209-Pin BGA
250
/6.7
I
Notes:
1.
2.
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS817x72B-300T.
The speed column indicates the cycle frequency (MHz) of the device in Pipelined mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode selectable by the user.
T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
3.
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