參數(shù)資料
型號: GS8170S72
廠商: GSI TECHNOLOGY
英文描述: 16Mb(256K x 72Bit)Synchronous SRAM(16M位(256K x 72位)同步靜態(tài)RAM)
中文描述: 16Mb的(256 × 72Bit)同步SRAM(1,600位(256 × 72位)同步靜態(tài)內(nèi)存)
文件頁數(shù): 36/38頁
文件大?。?/td> 934K
代理商: GS8170S72
Rev: 1.01 11/2000
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.
36/38
2000, Giga Semiconductor, Inc.
A
Advanced Information
GS8170S18/36/72B-333/300/275/250
Package Dimensions—209-Bump BGA
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
Symbol
Min.
Typ.
Max.
Units
A
1.7
mm
A1
0.40
0.50
0.60
mm
A2
0.31
0.36
0.38
mm
b
0.50
0.60
0.70
mm
D
21.9
22.0
22.1
mm
D1
18.0 (BSC)
mm
E
13.9
14.0
14.1
mm
E1
10.0 (BSC)
mm
e
1.00 (BSC)
mm
ddd
0.15
mm
Rev 1.2
A
A1
A2
b
e
e
E
E
D1
D
ddd
Bottom View
Side View
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