- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1900 > ADUC812BSZ-REEL (Analog Devices Inc)IC MCU FLASH 12BIT ADC 52MQFP PDF資料下載
參數(shù)資料
| 型號： | ADUC812BSZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 38/57頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU FLASH 12BIT ADC 52MQFP |
| 標(biāo)準(zhǔn)包裝： | 800 |
| 系列： | MicroConverter® ADuC8xx |
| 核心處理器： | 8052 |
| 芯體尺寸： | 8-位 |
| 速度： | 16MHz |
| 連通性： | I²C，SPI，UART/USART |
| 外圍設(shè)備： | PSM，溫度傳感器，WDT |
| 輸入/輸出數(shù)： | 34 |
| 程序存儲器容量： | 8KB（8K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 640 x 8 |
| RAM 容量： | 256 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b，D/A 2x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 52-QFP |
| 包裝： | 帶卷 (TR) |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁當(dāng)前第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁
REV.
ADuC812
–43–
Grounding and Board Layout Recommendations
As with all high resolution data converters, special attention
must be paid to grounding and PC board layout of ADuC812
based designs in order to achieve optimum performance from
the ADC and DACs.
Although the ADuC812 has separate pins for analog and digital
ground (AGND and DGND), the user must not tie these to two
separate ground planes unless the two ground planes are connected
together very close to the ADuC812, as illustrated in the simpli-
fied example of Figure 45a. In systems where digital and analog
ground planes are connected together somewhere else (for example,
at the system’s power supply), they cannot be connected again
near the ADuC812 since a ground loop would result. In these
cases, tie the ADuC812’s AGND and DGND pins all to the
analog ground plane, as illustrated in Figure 45b. In systems with
only one ground plane, ensure that the digital and analog com-
ponents are physically separated onto separate halves of the board
such that digital return currents do not flow near analog circuitry
and vice versa. The ADuC812 can then be placed between the
digital and analog sections, as illustrated in Figure 45c.
In all of these scenarios, and in more complicated real-life appli-
cations, keep in mind the flow of current from the supplies and
back to ground. Make sure the return paths for all currents are
as close as possible to the paths the currents took to reach their
destinations. For example, do not power components on the
analog side of Figure 45b with DVDD since that would force
return currents from DVDD to flow through AGND. Also, try to
avoid digital currents flowing under analog circuitry, which could
happen if the user placed a noisy digital chip on the left half of the
board in Figure 45c. Whenever possible, avoid large discontinuities
in the ground plane(s) (formed by a long trace on the same
layer), since they force return signals to travel a longer path. And
of course, make all connections to the ground plane directly,
with little or no trace separating the pin from its via to ground.
If the user plans to connect fast logic signals (rise/fall time < 5 ns)
to any of the ADuC812’s digital inputs, add a series resistor to
each relevant line to keep rise and fall times longer than 5 ns at the
ADuC812 input pins. A value of 100 or 200 is usually suffi-
cient to prevent high speed signals from coupling capacitively
into the ADuC812 and affecting the accuracy of ADC conversions.
b.
DGND
AGND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
c.
GND
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
DGND
AGND
PLACE ANALOG
COMPONENTS
HERE
a.
PLACE DIGITAL
COMPONENTS
HERE
Figure 45. System Grounding Schemes
F
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADUC814BRU | IC ADC 12BIT W/FLASH MCU 28TSSOP |
| ADUC816BCP | IC MCU 8K FLASH ADC/DAC 56LFCSP |
| ADUC824BSZ-REEL | IC MCU 8K FLASH ADC/DAC 52MQFP |
| ADUC831BCPZ | IC MCU 62K FLASH ADC/DAC 56LFCSP |
| ADUC832BSZ-REEL | IC MCU 62K FLASH ADC/DAC 52MQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADUC813BS | 制造商:Analog Devices 功能描述:12-BIT ADC WITH EMBEDDED MCU I.C. - Trays |
| ADUC814 | 制造商:AD 制造商全稱:Analog Devices 功能描述:MicroConverter, Small Package 12-Bit ADC with Embedded Flash MCU |
| ADUC814_02 | 制造商:AD 制造商全稱:Analog Devices 功能描述:MicroConverter, Small Package 12-Bit ADC with Embedded FLASH MCU |
| ADUC814AN | 功能描述:8052 MicroConverter? ADuC8xx Microcontroller IC 8-Bit 16.78MHz 8KB (8K x 8) FLASH 制造商:analog devices inc. 系列:MicroConverter? ADuC8xx 包裝:- 零件狀態(tài):上次購買時間 核心處理器:8052 核心尺寸:8-位 速度:16.78MHz 連接性:I2C，SPI，UART/USART 外設(shè):POR，PSM，溫度傳感器，WDT I/O 數(shù):- 程序存儲容量:8KB（8K x 8） 程序存儲器類型:閃存 EEPROM 容量:640 x 8 RAM 容量:256 x 8 電壓 - 電源（Vcc/Vdd）:2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:* 振蕩器類型:內(nèi)部 工作溫度:* 封裝/外殼:- 供應(yīng)商器件封裝:- 標(biāo)準(zhǔn)包裝:1 |
| ADUC814ARU | 功能描述:IC ADC 12BIT W/FLASH MCU 28TSSOP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC8xx 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲器容量:4KB（4K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。