參數(shù)資料
型號(hào): UPD30181AYF1-131-GA3-A
廠商: NEC Corp.
英文描述: 64-/32-BIT MICROPROCESSOR
中文描述: 64-/32-BIT微處理器
文件頁數(shù): 69/72頁
文件大?。?/td> 447K
代理商: UPD30181AYF1-131-GA3-A
Data Sheet U16277EJ1V0DS
69
μ
PD30181A, 30181AY
4. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD30181A and 30181AY should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales
representative.
Table 4-1. Soldering Conditions for Surface-Mount Type
(a)
μ
PD30181AF1-131-GA3: 240-pin plastic FBGA (16
×
16)
μ
PD30181AYF1-131-GA3: 240-pin plastic FBGA (16
×
16)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds or less (210
°
C or higher),
Count: two times or less, Exposure limit: 3 days
20 hours)
Note
(after that, prebake at 125
°
C for
IR35-203-2
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
(b)
μ
PD30181AF1-131-GA3-A
μ
PD30181AYF1-131-GA3-A
Note
: 240-pin plastic FBGA (16
×
16)
Note
: 240-pin plastic FBGA (16
×
16)
For soldering methods and conditions, contact an NEC sales representative.
Note
Lead-free product
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