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| 型號： | PPC440GR-3BB533CZ |
| 廠商： | APPLIEDMICRO INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA456 |
| 封裝： | 35 X 35 MM, PLASTIC, BGA-456 |
| 文件頁數(shù)： | 63/88頁 |
| 文件大?。?/td> | 1177K |
| 代理商： | PPC440GR-3BB533CZ |
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66
AMCC Proprietary
Revision 1.19 – May 07, 2008
Preliminary Data Sheet
440GR – PPC440GR Embedded Processor
Test Conditions
Clock timing and switching characteristics are specified in accordance with operating
conditions shown in the table “Recommended DC Operating Conditions.” AC
specifications are characterized with VDD = 1.5V, TC = +85 °C and a 50pF test load as
shown in the figure to the right.
Table 16. DC Power Supply Loads
Parameter
Symbol
Typical
Maximum
Unit
Notes
VDD (1.5V) active operating current
IDD
1250
1900
mA
OVDD (3.3V) active operating current
IODD
10
100
mA
SVDD (2.5V) active operating current
ISDD
460
600
mA
AVDD (1.5V) input current
IADD
3.2
5
mA
1
SAVDD (1.5V) active operating current
ISADD
6.05
10
mA
1
Notes:
1. See “Absolute Maximum Ratings” on page 61 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. VDD current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD current and power
are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
3. Typical current is estimated at 667MHz with VDD = +1.5V, OVDD = +3.3V, SVDD = +2.5V, and TC = +85°C, while running Linux and a test
application that exercises each core with representative traffic.
4. Maximum current is estimated at 667MHz with VDD = +1.6V, OVDD = +3.6V, SVDD = +2.7V, and TC = +85°C, and best-case process
(which drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.
Table 17. Package Thermal Specifications
Thermal resistance values for the E-PBGA package are as follows:
Parameter
Symbol
Package
Airflow
ft/min (m/sec)
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-ambient thermal resistance
without heat sink
θ
JA
E-PBGA
20.0
18.7
17.9
°C/W
TE-PBGA
15.6
13.6
12.8
°C/W
Junction-to-ambient thermal resistance
with heat sink
θ
JA
E-PBGA
15.3
11.9
10.5
°C/W
TE-PBGA
13.9
10.4
9.0
°C/W
Resistance Value
Junction-to-case thermal resistance
θ
JC
E-PBGA
8.3
°C/W
TE-PBGA
6.3
°C/W
Junction-to-board thermal resistance
θ
JB
E-PBGA
14.3
°C/W
TE-PBGA
9.3
°C/W
Output
Pin
50pF
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