參數(shù)資料
型號: KBE00F005A
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 512Mb NAND*2 + 256Mb Mobile SDRAM*2
中文描述: 的512Mb的NAND * 2 256Mb的移動SDRAM * 2
文件頁數(shù): 80/87頁
文件大?。?/td> 1353K
代理商: KBE00F005A
KBE00F005A-D411
MCP MEMORY
June 2005
80
Revision 1.0
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CKE
CS
RAS
CAS
BA1
A10/AP
CL=3
ADDR
WE
: Don’t care
CLOCK
Read Interrupted by Precharge Command & Read Burst Stop Cycle @Full Page Burst
HIGH
RAa
CL=2
Row Active
(A-Bank)
*NOTE:
1. At full page mode, burst is finished by burst stop or precharge.
2. About the valid DQs after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated above timing diagram. See the label 1, 2 on them.
But at burst write, Burst stop and RAS interrupt should be compared carefully.
Refer the timing diagram of "Full page write burst stop cycle".
3. Burst stop is valid at every burst length.
BA0
DQM
QAa3
CAa
CAb
Burst Stop
Precharge
(A-Bank)
DQ
{
QAa4
1
1
QAa2 QAa3 QAa4
2
RAa
Read
(A-Bank)
Read
(A-Bank)
QAa1
QAa0
QAa2
QAa1
QAa0
QAb1
QAb0
QAb2 QAb3 QAb4 QAb5
QAb1
QAb0
QAb2 QAb3 QAb4 QAb5
2
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