參數(shù)資料
型號(hào): IRF6691
廠商: International Rectifier
英文描述: HEXFET Power MOSFET plus Schottky Diode
中文描述: HEXFET功率MOSFET的加肖特基二極管
文件頁(yè)數(shù): 1/10頁(yè)
文件大?。?/td> 228K
代理商: IRF6691
www.irf.com
1
11/3/04
IRF6691
HEXFET Power MOSFET plus Schottky Diode
V
DSS
R
DS(on)
max
20V
2.5m
@V
GS
= 4.5V
1.8m
@V
GS
= 10V
Notes
through are on page 10
DirectFET
ISOMETRIC
Application Specific MOSFETs
Integrates Monolithic Trench Schottky Diode
Ideal for CPU Core DC-DC Converters
Low Conduction Losses
Low Reverse Recovery Losses
Low Switching Losses
Low Reverse Recovery Charge and Low Vf
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
Description
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Absolute Maximum Ratings
8 ,, 79
8
73
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Applicable DirectFET Package/Layout Pad (see p.8,9 for details)
SQ
SX
ST
MQ
MX
MT
Qg(typ.)
47nC
Parameter
Units
V
V
DS
V
GS
I
D
@ T
C
= 25°C
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
P
D
@T
C
= 25°C
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
A
W
W/°C
°C
T
J
T
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
–––
1.0
Max.
45
–––
–––
1.4
–––
Units
R
θ
JA
R
θ
JA
R
θ
JA
R
θ
JC
R
θ
J-PCB
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
°C/W
-40 to + 150
2.8
1.8
89
0.022
Max.
20
32
26
260
±12
180
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