參數(shù)資料
型號(hào)： BXM80526B700128
英文描述： Octal bus buffer with 3 state outputs (inverted)
中文描述： 微處理器
文件頁(yè)數(shù)： 59/81頁(yè)
文件大小： 598K
代理商： BXM80526B700128
Mobile Intel
Celeron Processor (0.18μ) in BGA2 and Micro-PGA2 Packages
Order Number#249563-001
Datasheet
59
6.
Thermal Specifications
This chapter provides needed data for designing a thermal solution. The mobile Intel Celeron
processor is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package
with the back of the processor die exposed and has a specified operational junction
temperature
(T
J
) limit.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 32. Mobile Intel Celeron Processor Power Specifications
Symbol
Parameter
TDP
Typ
1,3
TDP
Max
8.10
10.10
12.20
15.50
16.80
18.40
20.00
21.50
23.00
24.60
2,3
P
SGNT
3,4
P
QS
3,5
P
DSLP
3,6
Unit
Power
500 MHz & 1.10V
400A MHz & 1.35V
500 MHz & 1.35V
450 MHz & 1.60V
500 MHz & 1.60V
550 MHz & 1.60V
600 MHz & 1.60V
650 MHz & 1.60V
700 MHz & 1.60V
750 MHz & 1.60V
5.00
6.50
7.90
10.20
11.20
11.90
13.00
14.00
15.00
15.80
0.80
1.10
1.10
1.70
1.70
1.70
1.70
1.70
2.70
2.70
0.60
0.80
0.80
1.30
1.30
1.30
1.30
1.30
1.90
1.90
0.20
0.30
0.30
0.50
0.50
0.50
0.50
0.50
0.75
0.75
W
W
W
W
W
W
W
W
W
W
T
J
Junction temperature is
measured with the on-die
thermal diode
100
100
50
50
35
°C
Notes:
1.
TDP
(Thermal Design Power) is a recommendation based on the power dissipation of the processor
while executing publicly available software under normal operating conditions at nominal voltages. Not
100% tested.
TDP
is a specification of the total power dissipation of the processor while executing a worst-case
instruction mix under normal operating conditions at nominal voltages. It includes the power dissipated by
all of the components within the processor. Not 100% tested. Specified by design/characterization.
Not 100% tested or guaranteed. The power specifications are composed of the current of the processor on
the various voltage planes. These currents are measured and specified at high temperature in Table 9.
These power specifications are determined by characterization of the processor currents at higher
temperatures.
P
SGNT
is Stop Grant and Auto Halt power.
P
QS
is Quick Start and Sleep power.
P
DSLP
is Deep Sleep power.
2.
3.
4.
5.
6.
Table 32 provides the maximum Thermal Design Power (TDP
MAX
) dissipation and the minimum
and maximum T
J
temperatures for the mobile Intel Celeron processor. A thermal solution should
be designed to ensure the junction temperature never exceeds these specifications. If no closed
loop thermal failsafe mechanism (processor throttling) is present to maintain T
J
within
specification then the thermal solution should be designed to cool the TDP
MAX
condition. If a
thermal failsafe mechanism is present then thermal solution could possibly be designed to a
typical Thermal Design Power (TDP
TYP
). TDP
TYP
is a thermal design power recommendation
based on the power dissipation of the processor while executing publicly available software under
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