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| 型號(hào)： | BXM80526B700128 |
| 英文描述： | Octal bus buffer with 3 state outputs (inverted) |
| 中文描述： | 微處理器 |
| 文件頁(yè)數(shù)： | 46/81頁(yè) |
| 文件大小： | 598K |
| 代理商： | BXM80526B700128 |
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Mobile Intel
Celeron Processor (0.18μ) in BGA2 and Micro-PGA2 Packages
Datasheet
Order Number#249563-001
46
5.
Mechanical Specifications
5.1
Surface-mount BGA2 Package Dimensions
The mobile Intel Celeron processor is packaged in a PBGA-B495 package (also known as BGA2)
with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Intel Celeron processor die may be polished and very smooth.
The mechanical specifications for the surface-mount package are provided in Table 27. Figure 19
shows the top and side views of the surface-mount package, and Figure 20 shows the bottom view
of the surface-mount package. The substrate may only be contacted within the shaded region
between the keep-out outline and the edge of the substrate. The mobile Intel Celeron processor
will have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Please note that in order to implement VID on the BGA2 package,
some VID[4:0] balls may be depopulated.
Table 27. Surface-mount BGA2 Package Specifications
Symbol
Parameter
Min
Max
Unit
A
Overall Height, as delivered
2.29
2.79
mm
A
1
Substrate Height, as delivered
1.50 REF
mm
A
2
Die Height
0.854 REF
mm
b
Ball Diameter
0.78 REF
mm
D
Package Width
27.05
27.35
mm
mm
D
1
Die Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
30.85
E
Package Length
31.15
mm
e
Ball Pitch
1.27
mm
mm
E
1
Die Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
495
N
Ball Count
each
S
1
Outer Ball Center to Short Edge of Substrate
0.895 REF
mm
S
2
Outer Ball Center to Long Edge of Substrate
0.900 REF
mm
P
DIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
4.5 REF
grams
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