參數(shù)資料
型號(hào): BXM80526B700128
英文描述: Octal bus buffer with 3 state outputs (inverted)
中文描述: 微處理器
文件頁數(shù): 49/81頁
文件大?。?/td> 598K
代理商: BXM80526B700128
Mobile Intel
Celeron Processor (0.18μ) in BGA2 and Micro-PGA2 Packages
Order Number#249563-001
Datasheet
49
Table 28. Socketable Micro-PGA2 Package Specification
Symbol
Parameter
Min
Max
Unit
A
Overall Height, top of die to seating plane of interposer
3.13
3.73
mm
A
1
Pin Length
1.25 REF
mm
A
2
Die Height
0.854 REF
mm
B
Pin Diameter
0.30 REF
mm
D
2
Package Width
28.27 REF
mm
D
Die Substrate Width
27.05
27.35
mm
mm
D
1
Die Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
34.21 REF
E
2
Package Length
mm
E
Die Substrate Length
30.85
31.15
mm
mm
E
1
Die Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
1.27
e
Pin Pitch
mm
Pin Tip Radial True Position
0.127 REF
mm
N
Pin Count
495
each
S
1
Outer Pin Center to Short Edge of Substrate
2.144 REF
mm
S
2
Outer Pin Center to Long Edge of Substrate
1.206 REF
mm
P
DIE
Allowable Pressure on the Die for Thermal Solution
689
kPa
W
Package Weight
6.2 REF
grams
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