參數(shù)資料
型號(hào)： VSC7212RG
廠商： VITESSE SEMICONDUCTOR CORP
元件分類： 網(wǎng)絡(luò)接口
英文描述： Gigabit Interconnect Chip
中文描述： DATACOM, ETHERNET TRANSCEIVER, PQFP100
封裝： 14 X 14 MM, 1 MM HEIGHT, THERMALLY ENHANCED, CAVITY-DOWN, PLASTIC, TQFP-100
文件頁(yè)數(shù)： 32/34頁(yè)
文件大?。?/td> 504K
代理商： VSC7212RG
VITESSE
Preliminary Data Sheet
VSC7212
Gigabit Interconnect Chip
Page 32
G52268-0, Rev 3.3
04/10/01
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano
Camarillo, CA 93012
Tel: (800)-VITESSE
FAX: (805) 987-5896
Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Package Thermal Considerations
The VSC7212 is packaged in a 100-pin, 14x14x1.0mm, cavity-down, thermally-enhanced TQFP. This
package uses an industry-standard EIAJ footprint but has been enhanced to improve thermal dissipation. The
construction of the package is shown in Figure 23.
Figure 23: TQFP Package Cross Section
Table 17: Thermal Resistance
The VSC7212 is designed to operate with a case temperature up to 100
o
C. The user must guarantee that the
case temperature specification is not violated. With the thermal resistances shown above, the 14mm thermally-
enhanced PQFP can operate in still air ambient temperatures of 52.1
o
C [52.1
o
C = 100
o
C - 1.0W * 39.9]. If the
ambient air temperature exceeds these limits then some form of cooling through a heatsink or an increase in
airflow must be provided.
Moisture Sensitivity Level
This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30
o
C,
60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.
Symbol
θ
ca
Description
TQFP
Units
Thermal resistance from case to ambient in still air including conduction
through the leads.
39.9
o
C/W
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case to ambient with 100 LFM airflow
37.1
o
C/W
Thermal resistance from case to ambient with 200 LFM airflow
35.3
o
C/W
Thermal resistance from case to ambient with 400 LFM airflow
33.5
o
C/W
Thermal resistance from case to ambient with 600 LFM airflow
31.7
o
C/W
Internal Heat Spreader
Die
Plastic Molding Compound
Lead
Bond Wire
Insulator
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