參數(shù)資料
型號(hào): MAX9856ETL+T
廠商: Maxim Integrated Products
文件頁數(shù): 38/46頁
文件大?。?/td> 0K
描述: IC AUDIO CODEC 40TQFN-EP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
類型: 音頻編解碼器
數(shù)據(jù)接口: 串行
分辨率(位): 18 b
ADC / DAC 數(shù)量: 2 / 2
三角積分調(diào)變:
S/N 比,標(biāo)準(zhǔn) ADC / DAC (db): 77 / 91
動(dòng)態(tài)范圍,標(biāo)準(zhǔn) ADC / DAC (db): 85 / 91
電壓 - 電源,模擬: 1.71 V ~ 3.6 V
電壓 - 電源,數(shù)字: 1.71 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 40-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 40-TQFN-EP(5x5)
包裝: 帶卷 (TR)
PCB Layout and Bypassing
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents any switching noise from coupling
into the audio signal. Connect AGND, DGND, CPGND,
and PGND together at a single point on the PCB using
the star grounding technique. Route DGND, CPGND,
and all traces that carry switching transients or digital
signals separately from AGND and the analog audio
signal paths. Ground all components associated with
the charge pump to CPGND (CPVSS bypassing and
CPVDD bypassing). Connect all digital I/O termination
to DGND including DVDD and DVDDS2 bypassing.
Bypass REF and MICBIAS to AGND.
Connect PVSS and SVSS together at the device and
place the charge-pump hold capacitor (C2) as close to
SVSS as possible and ground to CPGND. Bypass
CPVDD with a 1F capacitor to CPGND and place the
bypass capacitor as close to the device as possible.
The MAX9856 thin QFN package features an exposed
thermal pad on its underside. This pad lowers the pack-
age’s thermal resistance by providing a direct heat
conduction path from the die to the PCB. Connect the
exposed thermal pad to AGND.
An evaluation kit (EV Kit) is available to provide an
example layout for the MAX9856. The EV Kit allows
quick setup of the MAX9856 and includes easy-to-use
software allowing all internal registers to be controlled.
MAX9856
Low-Power Audio CODEC with
DirectDrive Headphone Amplifiers
______________________________________________________________________________________
43
Chip Information
PROCESS: BiCMOS
Pin Configuration
MAX9856
THIN QFN
(6mm x 6mm)
TOP VIEW
35
36
34
33
12
11
13
LINEIN2
PREG
NREG
MBIAS
REF
14
LINEIN1
SDIN
BCLK
LRCLK_D
DVDDS2
LRCLK_A
MCLK
IRQ
SDA
12
INLP
45
6
7
27
28
29
30
26
24 23
22
MICL
MICGND
CPGND
C1N
PVSS
SVSS
AUXIN
SDOUT
3
25
37
MICR
HPR
38
39
*EP
+
* EP = EXPOSED PAD.
40
MICBIAS
AGND
JACKSNS
HPL
AVDD
HGNDSNS
INLN
32
15
C1P
DGND
31
16
17
18
19
20 CPVDD
LGNDSNS
LOUTL
LOUTR
SCL
89
10
21
DVDD
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