參數(shù)資料
型號: K4B4G0846B-MCF80
元件分類: DRAM
英文描述: 512M X 8 DDR DRAM, 0.3 ns, PBGA78
封裝: HALOGEN FREE AND ROHS COMPLIANT, FBGA-78
文件頁數(shù): 20/59頁
文件大小: 1079K
代理商: K4B4G0846B-MCF80
Page 27 of 59
Rev. 1.0 March 2009
DDP 4Gb DDR3 SDRAM
K4B4G0446B
K4B4G0846B
CK
Begin point : Rising edge of CK - CK
with ODT being first registered low
tAOFPD
VTT
DQ, DM
DQS , DQS
TDQS , TDQS
VRTT_Nom
TSW1
TSW2
VSW1
VSW2
End point Extrapolated point at VRTT_Nom
VSSQ
CK
Begin point : Rising edge of CK - CK
defined by the end point of ODTLcnw
tADC
VTT
DQ, DM
DQS , DQS
TDQS , TDQS
VRTT_Nom
TSW11
TSW21
VSW1
End point Extrapolated point at VRTT_Nom
VRTT_Wr
End point Extrapolated point at VRTT_Wr
tADC
VSW2
Begin point : Rising edge of CK - CK defined by
the end point of ODTLcwn4 or ODTLcwn8
End point
Extrapolated point
at VRTT_Nom
TSW12
TSW22
VRTT_Nom
VSSQ
Figure 17. Definition of tAOFPD
Figure 18. Definition of tADC
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4B4G0846B-MCH9 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDP 4Gb B-die DDR3 SDRAM Specification
K4B4G0846D-BCK0000 制造商:Samsung Semiconductor 功能描述:
K4B4G1646B-HCH9000 制造商:Samsung Semiconductor 功能描述:
K4B4G1646B-HCK000 制造商:Samsung Semiconductor 功能描述:
K4B4G1646B-HCK0000 制造商:Samsung 功能描述:DDR SGRAM X16 TSOP2 - Trays