參數(shù)資料
型號(hào): HB52R329E22
廠商: Hitachi,Ltd.
英文描述: 256 MB Registered SDRAM DIMM(256 MB 寄存同步DRAM DIMM)
中文描述: 注冊(cè)使用256 MB SDRAM的內(nèi)存(256 MB的寄存同步的DRAM內(nèi)存)
文件頁(yè)數(shù): 16/67頁(yè)
文件大?。?/td> 630K
代理商: HB52R329E22
HB52R329E22-D
16
DC Characteristics
(Ta = 0 to 55
°
C, V
CC
= 3.3 V
±
0.3 V, V
SS
= 0 V)
HB52R329E22
-A6D/B6D
Parameter
Symbol
Min
Max
Unit
Test conditions
Notes
Operating current
(
CE
latency = 3)
(
CE
latency = 4)
I
CC1
I
CC1
2315
mA
Burst length = 1
t
RC
= min
1, 2, 3
2315
mA
Standby current in power down I
CC2P
Standby current in power down
(input signal stable)
803
mA
CKE = V
IL
, t
CK
= 12 ns
CKE = V
IL
, t
CK
=
6
I
CC2PS
767
mA
7
Standby current in non power
down
I
CC2N
1271
mA
CKE,
S
= V
IH
,
t
CK
= 12 ns
CKE = V
IL
, t
CK
= 12 ns
4
Active standby current in power
down
I
CC3P
839
mA
1, 2, 6
Active standby current in non
power down
I
CC3N
1415
mA
CKE,
S
= V
IH
,
t
CK
= 12 ns
t
CK
= min, BL = 4
1, 2, 4
Burst operating current
(
CE
latency = 3)
(
CE
latency = 4)
I
CC4
I
CC4
I
CC5
I
CC6
2315
mA
1, 2, 5
2315
mA
Refresh current
3125
mA
t
RC
= min
V
IH
V
– 0.2 V
V
IL
0.2 V
0
Vin
V
CC
0
Vout
V
CC
DQ = disable
3
Self refresh current
731
mA
8
Input leakage current
I
LI
I
LO
–10
10
μ
A
μ
A
Output leakage current
–10
10
Output high voltage
V
OH
V
OL
2.4
V
I
OH
= –4 mA
I
OL
= 4 mA
Output low voltage
Notes: 1. I
depends on output load condition when the device is selected. I
CC
(max) is specified at the
output open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK operating current.
7. After power down mode, no CK operating current.
8. After self refresh mode set, self refresh current.
0.4
V
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