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參數(shù)資料
| 型號(hào)： | XC17256EPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 9/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 產(chǎn)品變化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 可編程類型： | OTP |
| 存儲(chǔ)容量： | 256Kb |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
| 其它名稱： | 122-1576-5 |
UG112 (v3.7) September 5, 2012
Device Package User Guide
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
01/31/04
1.0
Initial release
02/04/05
1.1
Added Pb-free packaging information.
05/31/06
2.0
Extensive updates and new material added.
05/18/07
3.0
Updated “Material Data Declaration Sheet (MDDS)” in Chapter 1; revised link to “Xilinx
Packaging Material Content Data for Standard and PB-Free Packages”.
Updated “Flip-Chip BGA Packages” in Chapter 1; added content to “Package
Construction” to clarify Type I and Type II lid usage.
Chapter 3; removed “Junction-to-Board Measurement -
ΨJB”, added link to new “Data
Thermal Data Query for Device-Specific Data” (query tool replaces Table 3-1: “Summary
of Thermal Resistance for Packages”, which was removed).
page 87; added missing (D) values for CP56 and CP132 packages and corrected SF363
package specification (D) value in Table 5-3, page 88. Added CS48 to Table 5-4, page 88.
Updated Table 6-2, page 108 to include MSL ratings for Pb-free packages.
Updated “Package Peak Reflow Temperature” in Chapter 7; correction to peak reflow
temperature. Added post-wash bake details to “Post Reflow Washing” section.
12/18/08
3.1
Added link to Package Thermal Data Query Tool on xilinx.com. Updated remaining
external links.
Added Spartan-3A DSP information to Table 1-1, page 13.
Added these packages to Table 2-3, page 36: FG484 and FGG484.
Added these packages to Table 5-3, page 88: SFG363, FF676, FGG484, FFG676, FT64 and
FTG64.
Removed these packages from Table 5-3, page 88: FF896, FFG896, FF1704, FFG1704,
FF1696 and FFG1696.
Added these packages to Table 5-4, page 88: CS484 and CSG484.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256L-PC20C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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