參數(shù)資料
| 型號： | XC17256EPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 10/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 產品變化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 標準包裝： | 50 |
| 可編程類型： | OTP |
| 存儲容量： | 256Kb |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應商設備封裝： | 8-PDIP |
| 包裝： | 管件 |
| 其它名稱： | 122-1576-5 |
Device Package User Guide
UG112 (v3.7) September 5, 2012
03/17/09
3.2
Revised “Small Form Factor Packages,” page 15 to include description of third template
used for marking small form factor packages.
Revised “Package Construction,” page 20 to describe flip-chip package vent hole
locations.
Added missing Pb-free packages to Table 1-3, page 27.
Revised mass of FG676 and FGG676 packages in Table 1-3, page 27.
Added CS484 and CSG484 information to Table 1-3, page 27 and Table 2-3, page 36.
Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36.
Changed link from DS529 to UG331 in third paragraph of “Data Acquisition and
Added CS484 electrical data to Table 4-1, page 75.
Added note to Table 5-3, page 88, referring to UG195.
Revised humidity value in third paragraph of “Dry Bake Recommendation and Dry Bag
Revised humidity value in first and fourth paragraph of “Expiration Date,” page 107.
Updated links in Table A-1, page 121.
04/23/09
3.3
Added FG400, FGG400, FF323, FFG323, FF324, FFG324, FF665, FFG665, FF676, FFG676,
FF1153, FFG1153, FF1156, FFG1156, FF1738, FFG1738, FF1760, and FFG1760 to Table 2-3,
Revised the via land diameters for CF1140, CF1144, and CF1509 packages in Table 5-5,
06/10/09
3.4
Revised third paragraph of “Package Construction,” page 20 about EF flip-chip package
epoxy protection.
Revised second paragraph of “Post Reflow Washing,” page 117 excepting EF packages
from cleaning solution/solvent recommendation.
11/06/09
3.5
Added link to MDDS documents under “Material Data Declaration Sheet (MDDS),”
page 10. Added FF896, EF1152, EF1704, FF1704, EF668, and EF672 to Table 5-3, page 88.
Added EF957 to Table 5-4, page 88.
09/22/10
3.6
Added CS225/CSG225 and CS324/CSG324 in Table 2-3, page 36. Added CF1752 to
heading in CF1509 column, and changed “Solder (ball) land pitch” to “Solder (column)
land pitch” in Table 5-5, page 89. Added VO48/VOG48 in Table 6-2, page 108.
09/05/12
3.7
Updated “Thermal Management,” page 39. Updated “Characterization Methods,”
Measurement — qJC,” page 49, with JEDEC Standard JESD51-14. Updated document
references in “Data Acquisition and Package Thermal Database,” page 52. Removed
“Junction-to-Top Measurement —
ΨJT” and “Support for Compact Thermal Models
Date
Version
Revision
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相關代理商/技術參數(shù) |
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| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17256L-PC20C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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