參數(shù)資料
型號: XC17256EPDG8C
廠商: Xilinx Inc
文件頁數(shù): 7/15頁
文件大?。?/td> 0K
描述: IC PROM SERIAL 256K 8-DIP
產(chǎn)品變化通告: XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010
Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝: 50
可編程類型: OTP
存儲容量: 256Kb
電源電壓: 4.75 V ~ 5.25 V
工作溫度: 0°C ~ 70°C
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
其它名稱: 122-1576-5
Device Package User Guide
15
UG112 (v3.7) September 5, 2012
Part Marking
R
Small Form Factor Packages
A second template is used on smaller packages that do not have enough room for six lines
of marking. This marking is used mainly for PROMs, and can be found on some medium-
size packages as well.
Line 1
X-Ref Target - Figure 1-1
Figure 1-1:
Top Marking (for Large Device Packages)
FFG1136xxxXXXX
1C
DxxxxxxxA
XC5VLX50T
- ES
Device Type
Package
Speed Grade
Operating Range
Lot Code
Engineering Sample
UG112_C1_01_040709
TM
R
Date Code
Table 1-2:
Xilinx Device Marking Definition—Example
Item
Description
Corporate Logo
Xilinx logo, Xilinx name with trademark, and trademark-registered status.
Family Brand Logo
Product family name with trademark and trademark-registered status. This line is optional and
could appear blank.
1st Line
Device type.
2nd Line
Package type and pin count, circuit design revision, the location code for the wafer fab, the
geometry code, and date code.
A G in the third letter of a package type indicates a Pb-free RoHS compliant package. For more
details on Xilinx Pb-Free and RoHS Compliant Products, see:
3rd Line
Ten alphanumeric characters for assembly, lot, and step information. The last digit is usually an
A or an M if a stepping version does not exist.
4th Line
Device speed grade and temperature range. If a grade is not marked on the package, the
product is considered commercial grade.
Other variations for the 4th line:
1C-xxxx
The xxxx indicates the SCD for the device. An SCD is a special ordering code
that is not always marked in the device top mark.
1C-ES
The ES indicates an Engineering Sample.
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