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參數(shù)資料
| 型號： | XC17256EPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 15/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 產(chǎn)品變化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 可編程類型： | OTP |
| 存儲容量： | 256Kb |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
| 其它名稱： | 122-1576-5 |
Device Package User Guide
9
UG112 (v3.7) September 5, 2012
R
Chapter 1
Package Information
Package Overview
Introduction to Xilinx Packaging
Electronic packages are interconnectable housings for semiconductor devices. The major
functions of the electronic packages are to provide electrical interconnections between the
IC and the board and to efficiently remove heat generated by the device.
Feature sizes are constantly shrinking, resulting in increased number of transistors being
packed into the device. Today's submicron technology is also enabling large-scale
functional integration and system-on-a-chip solutions. In order to keep pace with these
new advancements in silicon technologies, semiconductor packages have also evolved to
provide improved device functionality and performance.
Feature size at the device level is driving package feature sizes down to the design rules of
the early transistors. To meet these demands, electronic packages must be flexible to
address high pin counts, reduced pitch and form factor requirements. At the same time,
packages must be reliable and cost effective.
Packaging Technology at Xilinx
Xilinx provides a wide range of leaded and array packaging solutions for our advanced
silicon products. Xilinx advanced packaging solutions include overmolded plastic ball
grid arrays (PBGA), small form factor Chip Scale Packages, “Cavity-Down” BGAs,
flip-chip BGAs, flip-chip ceramic column grid arrays (CCGA), as well as the newer lead
frame packages such as Quad Flat No-Lead (QFN) packages to meet various pin counts
and density requirements. Packages from Xilinx are designed, optimized, and
characterized to support the long-term mechanical reliability requirements as well as to
support the cutting-edge electrical and thermal performance requirements for our high-
speed advanced FPGA products.
Pb-free Packaging Solutions from Xilinx
Xilinx also develops packaging solutions that are safer for the environment. Today,
standard packages from Xilinx do not contain substances that are identified as harmful to
the environment including cadmium, hexavalent chromium, mercury, PBB, and PBDE. Pb-
free solutions take that one step further and also do not contain lead (Pb). This makes Pb-
free solutions from Xilinx RoHS (Reduction of Hazardous Substances) compliant. Pb-free
packages from Xilinx are also JEDEC J-STD-020 compliant, meaning that the packages are
made to be more robust so they are capable of withstanding higher reflow temperatures.
Xilinx is now ready to support the industry requirements for Pb-free packaging solutions.
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| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256L-PC20C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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