- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄2018 > XC17256EPDG8C (Xilinx Inc)IC PROM SERIAL 256K 8-DIP PDF資料下載
參數(shù)資料
| 型號(hào)： | XC17256EPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁(yè)數(shù)： | 3/15頁(yè) |
| 文件大小： | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 產(chǎn)品變化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 可編程類型： | OTP |
| 存儲(chǔ)容量： | 256Kb |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
| 其它名稱： | 122-1576-5 |
第1頁(yè)第2頁(yè)當(dāng)前第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)
Device Package User Guide
11
UG112 (v3.7) September 5, 2012
Specifications and Definitions
R
Daisy Chain Samples XCDAISY-XXXXX (where XXXXX is the package code of interest)
Use this part type to perform board-based evaluations (such as vibrations and temperature
cycles) to see how well the solder balls withstand these mechanical conditions. For Xilinx
daisy chain parts (XCDAISY-XXXXX), a specific ball assignment chain is available. If you
do not have a board already made, you can use our default chain. You can purchase these
parts from Xilinx through standard sales outlets. Xilinx does not support unique chains
because these parts do not have the volume to justify the development effort.
Example:
To order a FG676 package in a daisy-chained configuration, the part number would be
XCDAISY-FG676.
Specifications and Definitions
Inches vs. Millimeters
The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in
inches. The lead spacing is specified as 25 mils, 50 mils, or 100 mils (0.025 in., 0.050 in. or
0.100 in.).
The JEDEC standards for PQFP, HQFP, TQFP, VQFP, CSP, and BGA packages define
package dimensions in millimeters. The lead frame packages have lead spacings of
0.5 mm, 0.65 mm, or 0.8 mm. The CSP and BGA packages have ball pitches of 0.5 mm,
0.8 mm, 1.00 mm, or 1.27 mm.
Because of the potential for measurement discrepancies, this Data Book provides
measurements in the controlling standard only, either inches or millimeters.
Pressure Handling Capacity
For mounted BGA packages, including flip chips, a direct compressive (non-varying) force
applied normally to the lid or top of package with a tool head that coincides with the lid (or
is slightly bigger) will not induce mechanical damage to the device including external
balls, provided the force is not over 5.0 grams per external ball, and the device and board
are supported to prevent any flexing or bowing.
These components are tested in sockets with loads in the 5 to 10 gm/ball range for short
durations. Analysis using a 10g/ball (e.g., 10 kg for FF1148) showed little impact on short-
term but some creep over time. 20 gm/ball and 45 gm/ball loads at 85
°C over a six week
period has shown the beginning of bridging of some outer balls; these were static load
tests. The component can survive forces greater than the 5 gm limit while in short-term
situations. However, sustained higher loads should be avoided (particularly if they are
overlaid with thermal or power cycle loads). Within the recommended limits, circuit board
needs to be properly supported to prevent any flexing resulting from force application.
Any flexing or bowing resulting from such a force can likely damage the package-to-board
connections. Besides the damage that can occur from bending, the only major concern is
long-term creep and bulging of the solder balls in compression to cause bridging. For the
life of a part, staying below the recommended limit will ensure against that remote
possibility.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XR2206DTR-F | IC FUNCTION GENERATOR 16SOIC |
| XR2209CP-F | IC FUNCTION GENERATOR 8PDIP |
| XRD5412AID-F | IC DAC 12BIT SRL 8SOIC |
| XRD54L12AID-F | IC DAC 12BIT SRL LP 8SOIC |
| XRD9816BCV-F | IC 16BIT CCD/CIS SIG PROC 48TQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256L-PC20C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。