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參數(shù)資料
| 型號： | SY89538L |
| 廠商： | Micrel Semiconductor,Inc. |
| 英文描述： | 3.3V PRECISION LVPECL AND LVDS PROGRAMMABLE MULTIPLE OUTPUT BANK CLOCK SYNTHESIZER AND FANOUT BUFFER WITH ZERO DELAY |
| 中文描述： | 3.3精密LVPECL和LVDS可編程多個OUTPUT銀行時鐘合成器與扇出緩沖器與零延遲 |
| 文件頁數(shù)： | 8/23頁 |
| 文件大?。?/td> | 628K |
| 代理商： | SY89538L |
Micrel, Inc.
Absolute Maximum Ratings
(1)
Supply Voltage (V
CCD
,
V
CCA
,
V
CCO
)......–0.5V to +4.0V
Input Voltage (RFCK, FBIN)...................–0.5V to V
CC
XTAL Input Voltage (V
XTAL1, 2
) .........V
CC
–1.9V to V
CC
Output Current (I
OUT
)
LVPECL Outputs (Surge) .........................100mA
LVPECL Outputs (Continuous)...................50mA
LVDS Outputs...........................................±10mA
Lead Temperature (soldering, 20 sec.)..........+260°C
Storage Temperature (T
s
) .................–65°C to 150°C
SY89538L
October 2005
hbwhelp@micrel.com
or (408) 955-1690
M9999-101105-B
8
Operating Ratings
(2)
Supply Voltage
V
CCO
A and V
CCO
C...............................+3.0V to +3.6V
V
CCO
B .............................................+2.375V to +3.6V
Ambient Temperature (T
A
).......................–40°C to +85°C
Package Thermal Resistance (Junction-to-Ambient)
With Die attach soldered to GND:
TQFP (
θ
JA
) Still-Air......................................23°C/W
TQFP (
θ
JA
) 200lfpm.....................................18°C/W
TQFP (
θ
JA
) 500lfpm.....................................15°C/W
With Die attach NOT soldered to GND
(3):
TQFP (
θ
JA
) Still-Air......................................44°C/W
TQFP (
θ
JA
) 200lfpm.....................................36°C/W
TQFP (
θ
JA
) 500lfpm.....................................30°C/W
Package Thermal Resistance (Junction-to-Board)
TQFP (
θ
JC
) ....................................................7°C/W
DC Electrical Characteristics
(4)
Power Supply
T
A
= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CCA
V
CCD
V
CCO
PLL Power Supply
Note 5
3.0
3.3
3.6
V
Control Logic Supply Voltage
Note 5
3.0
3.3
3.6
V
Output Supply Voltage
2.375
2.5
2.625
V
3.0
3.3
3.6
V
I
CC
I
CCA
I
CCO
I
CCD
Power Supply Current
No load, max. V
CC
, Note 6
Max. V
CC
No load, max. V
CC
Max. V
CC
240
300
mA
Analog Supply Current
10
mA
Output Supply Current
55
mA
Digital Supply Current
175
mA
LVCMOS/LVTTL Input Control Logic
V
CCA
= V
CCD
= +3.3V ±10%, V
CCO
= +2.5V ±5% or +3.3V ±10%; T
A
= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
IH
V
IL
I
IH
I
IL
Input High Voltage
2.0
V
Input Low Voltage
0.8
V
Input High Current
V
IN
= V
CC
V
IN
= 0.5V
–125
150
μA
Input Low Current
–300
μA
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. V
CCA
and V
CCD
are not internally connected. They must be connected together on the PCB.
6. I
CC
= I
CCA
+ I
CCO
+ I
CCD
.
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