參數(shù)資料
型號: RD38F1020C0ZTL0
廠商: INTEL CORP
元件分類: 存儲器
英文描述: 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA66
封裝: 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù): 1/70頁
文件大?。?/td> 1223K
代理商: RD38F1020C0ZTL0
3VoltIntel
Advanced+BootBlock
FlashMemory(C3)Stacked-ChipScale
PackageFamily
Datasheet
ProductFeatures
The3VoltIntel
Advanced+BootBlockFlashMemory(C3)Stacked-ChipScalePackage
(Stacked-CSP)devicedeliversafeature-richsolutionforlow-powerapplications.TheC3
Stacked-CSPmemorydeviceincorporatesflashmemoryandstaticRAMinonepackagewith
lowvoltagecapabilitytoachievethesmallestsystemmemorysolutionform-factortogetherwith
high-speed,low-poweroperations.TheC3Stacked-CSPmemorydeviceoffersaprotection
registerandflexibleblocklockingtoenablenextgenerationsecuritycapability.Combinedwith
theIntel
FlashDataIntegrator(Intel
FDI)software,theC3Stacked-CSPmemorydevice
providesacost-effective,flexible,codeplusdatastoragesolution.
FlashMemoryPlusSRAM
—ReducesMemoryBoardSpace
Required,SimplifyingPCBDesign
Complexity
Stacked-ChipScalePackage(Stacked-
CSP)Technology
—SmallestMemorySubsystemFootprint
—Area:8x10mmfor16Mbit(0.13μm)
Flash+2Mbitor4MbitSRAM
—Area:8x12mmfor32Mbit(0.13μm)
Flash+4Mbitor8MbitSRAM
—Height:1.20mmfor16Mbit(0.13μm)
Flash+2Mbitor4MbitSRAMand
32Mbit(0.13um)Flash+8MbitSRAM
—Height:1.40mmfor32Mbit(0.13μm)
Flash+4MbitSRAM
—ThisFamilyalsoincludes0.25μmand
0.18μmtechnologies
AdvancedSRAMTechnology
—70nsAccessTime
—LowPowerOperation
—LowVoltageDataRetentionMode
Intel
FlashDataIntegrator(FDI)
Software
—Real-TimeDataStorageandCode
ExecutionintheSameMemoryDevice
—FullFlashFileManagerCapability
Advanced+BootBlockFlashMemory
—70nsAccessTimeat2.7V
—Instant,IndividualBlockLocking
—128bitProtectionRegister
—12VProductionProgramming
—UltraFastProgramandEraseSuspend
—ExtendedTemperature–25°Cto+85°C
BlockingArchitecture
—BlockSizesforCode+DataStorage
—4-KwordParameterBlocks(fordata)
—64-KbyteMainBlocks(forcode)
—100,000EraseCyclesperBlock
LowPowerOperation
—AsyncReadCurrent:9mA(Flash)
—StandbyCurrent:7μA(Flash)
—AutomaticPowerSavingMode
FlashTechnologies
—0.25μmETOXVI,0.18μmETOX
VIIand0.13μmETOXVIIIFlash
Technologies
—28F160xC3,28F320xC3
252636-001
February,2003
Notice:
Thisdocumentcontainsinformationonnewproductsinproduction.Thespecifications
aresubjecttochangewithoutnotice.VerifywithyourlocalIntelsalesofficethatyouhavethelat-
estdatasheetbeforefinalizingadesign.
相關(guān)PDF資料
PDF描述
RD38F1010C0ZBL0 CAPACITOR, BESTCAP 33 MILLI FARAD 7V CAPACITOR, BESTCAP 33 MILLI FARAD 7V; CAPACITANCE:33MF; VOLTAGE RATING, DC:7V; CAPACITOR DIELECTRIC TYPE:ELECTRONIC; SERIES:BESTCAP; TEMP, OP. MAX:75(DEGREE C); TEMP, OP. MIN:-20(DEGREE C); RoHS Compliant: Yes
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RD38F1020C0ZTL0A 制造商:Micron Technology Inc 功能描述:32C/8S SCSP 3.0 - Trays
RD38F1020C0ZTL0B 制造商:Micron Technology Inc 功能描述:32C/8S SCSP 3.0 - Tape and Reel
RD38F1020C0ZTL0SB93 功能描述:IC FLASH 32MBIT 70NS 66EBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:1M (64K x 16) 速度:150ns 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:0°C ~ 70°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤
RD38F1020W0YBQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1020W0YBQ0SB93 功能描述:IC FLASH 32MBIT 65NS 66EBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M(64M x 8) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040